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Infrared (IR) sensor module deploy for hazardous gas leakage detection is crucial to provide and maintain offshore Oil & Gas platform asset integrity and improve operational risk management by avoiding accidental disaster and mitigating risk associated with danger involve in oil production. These sensor modules must remain robust under harsh ambient environment. Hence, designing novel high temperature...
In this paper, we investigate reliability testing for a glass interposer. The test vehicle is an assembled glass interposer with a chip, a BT substrate. The structure of a glass interposer with two redistribution layers (RDLs) on the front-side and one RDL on the back-side has been evaluated and developed. Key technologies, including via fabrication, front-side RDL formation, microbumping, temporary...
As the demands of higher performance, higher bandwidth, and lower power consumption as well as multiple functions increases, the industry is driving advance technology developments in emerging markets, especially in portable and mobile devices to meet these requirements. The utilization of emerging technologies is pushing smaller form factor package designs with finer line width and spacing as well...
A comparative investigation of the reliability of 60Coγ ray irradiation on bulk-Si substrate and SOI substrate double polysilicon self-aligned (DPSA) NPN bipolar transistors is presented. Bulk silicon based DPSA NPN transistors show severe current gain degradation at low injection level, and a monotonic increase in current gain degradation with decreasing Emitter-Base (E-B) voltage is observed. SOI...
In this work, the 14 nm CPI (Chip and Package Interaction) challenges, development and qualification were investigated by using 80 um pitch Cu pillar BOL (Bump on Lead) technology in flip chip CSP package. We evaluated 14 nm BEOL (Backend of Line) film strength and adhesion in the torture tests as an early assessment. After passing the torture tests, the package is evaluated in the CPI reliability...
Interconnect is one of the most important functions of packaging technology. It delivers power and signals into and out of electronic systems. The performance and reliability of microsystems are dependent on the interconnect quality. This paper reviews the chip-level interconnects based on carbon nanotubes (CNTs), this includes their applications for both on-chip and off-chip interconnects. Various...
In order to facilitate the evaluation the quality of layer compositions in terms of reliability, a new, non-destructive test method will be proposed in this paper. The new test method combines finite element simulations with creep testing. The advantage of this new method is that it gives a closer representation of the actual use conditions of the later device. This makes it easier to link results...
In terms of die-attach for high TJ device, metallization on the backside of the bare chip and the substrate surface affect the high-temperature reliability of the joint due to the accelerated atomic diffusions. We evaluated two types of electroless plated metallization schemes which are Ni/Ag and Ni/Pd/Pt/Ag, respectively. High temperature storage of 250 °C for 500 h was used to test the high temperature...
Recently, the eco-friendly vehicles such as Hybrid Electric Vehicle (HEV) and Electric Vehicle (EV) have been spotlighted. EV has power semiconductors which generate a lot of heat. So, the power semiconductors have to guarantee reliability because it is driven at high temperature. Furthermore, it was able to be driven at a higher temperature by developing the semiconductor devices such as SiC and...
For performance improvement of electromagnetic actuators an increasing amount of sensors providing real-time feedback of measureable system variables is needed. In industrial components usually several signals have to be detected or even controlled. Therefore numerous data are to be analyzed in a wide range of characteristics. To meet specific system requirements, e. g. weight and size, the sensors...
For mobile applications, advanced silicon technology nodes are using Back End Of Line (BEOL) stacks with Ultra Low-k (ULK) materials. Employing these ULK materials in combination with advanced Flip Chip (FC) packages requires a profound understanding of the chip package interaction (CPI). To match high I/O and reduced pitch requirements, Cu pillars are widely used as first level interconnect technology...
Printed hybrid electronics combining traditional semiconductor devices and polymer substrates allows augmenting the performance of printed electronics. In this work, chip bonding on plastic substrate, i.e. chip on flex (COF), using anisotropically conductive adhesive and LED chips was investigated. Unpackaged semiconductor chips were bonded to PET foil with printed silver conductors. The yield and...
For the high-power LED applications, TAV (Through-aluminum-nitride-via) substrate with a high thermal conductivity provides better heat dissipation. However, the high thermal expansion coefficient mismatch between the AlN (Aluminum nitride) and copper film may cause the failure, and thus affect the reliability of TAV substrate. The objective of this study is to evaluate the reliability of TAV substrate...
Increased end user reliability expectations coupled with the deployment of complex electronic systems in product applications such as automotive, military and avionics is driving a continual growth in the duration of validation testing.
Silver sintering is a potential die attach technology to replace the solder technology for power electronic systems. A design of experiments (DoE) is performed in order to investigate the influences of sinter parameters as sinter pressure, temperature, duration, drying temperature and the interactions of these parameters on the shear strength of the Ag-sinter connection. Four sinter pastes have been...
This paper describes the design, construction and performance of a 5 kVA aviation power module containing silicon carbide MOSFETs. The function and control of this module within a commercial aviation power electrical control unit (ECU) application is explained and the power dissipation benefits from the use of these MOSFETs instead of silicon IGBTs when driving an electrical motor controlling an aileron...
In this work we demonstrate, for the first time, the advantages of GaN HEMTs on bulk GaN substrates over similarly processed devices on Sapphire and Silicon substrates, intended for power applications, in terms of on-state and off-state operation as well as reliability, where self-heating, off-state leakage, and trapping effects are minimal. MIS-HEMTs with breakdown voltage of ∼670 V and off-state...
A 3-stage power amplifier (PA) with 14dBm saturated output power (Psat), 29.5 dB small-signal gain, and 4.8% power-added efficiency (PAE) at a frequency of 162GHz is presented. From 155 to 165 GHz, Psat remains higher than 12.5 dBm, while the small-signal gain varies from 35.4 dB to 28.3 dB. Maximum output power and gain performance are obtained by using a differential cascode topology and operating...
The heat dissipation is a crucial factor for the reliability of high power white LEDs(HPLEDs). In this paper, a novel thermal pad structure is presented for HPLEDs, a theoretic thermal transfer model is built to analyze the thermal transferring in LED component. Besides, the thermal simulations of the LED component with the typical or the novel thermal pad are conducted, the temperature distributions...
Due to its advantages in terms of cost, size, weight, performance and availability, plastic encapsulated devices are used widely. However, the long-term reliability of plastic encapsulated devices is influenced by the internal connection failure between dies and lead frames, including first bond, second bond, bond wire and die-attach. The paper introduced five common failure mechanisms of internal...
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