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Because of the complicated configuration in MEMS devices, significant technical challenges are presented for the interconnection of dissimilar materials. Since tin soldering is an effective method for joining dissimilar materials, there are still some reliability problems in later service process, such as remelting of Sn solder, excessive microstructure evolution. In the present work, a parallel gap...
Thermal Feedback Blocks are a viable approach to perform thermal and electrothermal simulations of electronics systems with very fast-switching inputs, for which the coupling of a finite-element method thermal solver with a physics-based or a circuit simulator cannot be used. In this work, we describe a RC-based thermal network improving the conventional Foster and Cauer solutions, which is used to...
The Ball-grid array BGA package can fail under thermo-mechanical loading such as thermal cycling. It is important to study the strain and stress of an electronic package using Finite Element Analysis (FEA) that is based on physical geometry and dimension. One can precisely view the real package dimension under the CT scan. Use of CT data for FE model creation will allow for greater ability to capture...
Selection of appropriate underfills (or encapsulants) for flip-chip packages is critical to their reliability. In this research article, we present a comprehensive study geared towards the development of such materials. Several underfill formulations were developed based on the target material property guidelines obtained from parametric numerical simulations. Material parameters such as base resin...
To stack more NAND memory dice in a package or to reduce package thickness, die thickness has to be thinner and thinner. This paper discusses the significant challenges associated with thin die in assembly process and device level reliability. A single die NAND memory ball grid array package was assembled with 4 different die thicknesses as a test vehicle to go through assembly process, temperature...
Fan-out chip on substrate (FOCoS) is defined as the fan-out package flip-chip mounts on high pin counts ball grid array substrate. 12-inch advanced wafer level package (aWLP) process is implemented on FOCoS for cost saving advantage. The fan-out package constructs from multi-chips with short interconnection between die to die (D2D) by re-distribution layer (RDL) process, which has the potential for...
In the electronic industry the portable devices are becoming the prime factors to dominate the market share. And with the blessing of miniaturization, these devices are also becoming smaller and smaller day by day. On the other hand, with this miniaturization process these devices are becoming more susceptible to drop impact loading. To ensure product quality and to integrate more complicated functionality...
This paper presents a comprehensive study on the reliability of QFN components for aerospace applications, particularly the impact of conformal coatings on the reliability of such QFN assemblies was investigated. Both experimental and computational modeling techniques are discussed. In the experiments, several types of plastic and ceramic QFNs assemblies were subjected to accelerated thermal cycling...
The through-silicon-via (TSV) technology is one of the most effective approaches to fulfill the form factor, profile, performance, and 3D interconnect demand of next generation handheld and wearable electronics. The TSV technology has been developed into two categories, the TSV Last and the TSV Middle. In this article, we examined a variety of aspects of the two TSV technologies when applied to 3D...
Over the past decade the electronics components industry successfully transitioned from the use of leaded solder to lead-free (Pb-free) solders in response to growing environmental health concerns related to heavy metals and other substances. Pbfree components in general are in compliance to meet the European restriction of hazardous substances (RoHS) directives. During the transition period to Pb-free...
3D printing technologies provide one of the most efficient methods for product design, prototyping and manufacture in a cost-effective, high-throughput, mass-customisation and energy efficient manner. One growing application of 3D printing includes the fabrication, packaging and integration of electronic structures and components. This paper presents modelling methodologies and toolsets that can be...
In modern metallization systems mechanical stress due to CTE mismatch is one of the reliability problems. With the help of finite element simulations the thermal-electrical-mechanical behavior can be calculated. The use of a reference temperature for the stress free state in the simulations is insufficient to determine the stress field in the metallization. The intrinsic stress resulting from the...
Laser-Ultrasonics is a technique seeking for maturity in the NDT for high speed train axles. When questioned for reliability, Probability of Detection (POD) Curves try to build the confidence on the stated method. In the recent period of time much work has been started for changing the conventional method of building POD curves by using Model Assisted POD curves or MAPOD. This method uses a simulated...
Structural Health Monitoring (SHM) gained great attention due to its significant role in lowering the cost and time of monitoring and maintaining structures. Guided wave techniques are widely used to detect damage in structures due to its sensitivity to different changes in the structure. That makes it very reliable for inspection of large complicated structures for cracks, corrosion and different...
Accurate thermal dynamics modeling of high power Insulated Gate Bipolar Transistor (IGBT) modules is important information for the reliability analysis and thermal design of power electronic systems. However, the existing thermal models have their limits to correctly predict these complicated thermal behaviors in the IGBTs. In this paper, a new three-dimensional (3D) lumped thermal model is proposed,...
The paper lists main application areas for variable frequency electric drives (VFD) at the iron and steel works. Their introduction at pump and ventilation equipment ensures a significant reserve of power saving. The paper provides evidence to the fact that the main obstruction for wide-range introduction of the frequency control systems is reduction of the facility reliability indexes. As a rule,...
The main purpose of this paper is to carry out a preliminary comparison between two linear tubular synchronous, three-phase generators for WEC (Wave Energy Converter) applications. The first device is a conventional one, with a single slotted stator and a mover which is composed of Permanent Magnets (PMs) arranged in an Halbach array. The second configuration has two concentric stators and a mover...
This paper studies how the underfill with viscoelastic properties impacts the thermal mechanical reliability of a 3D-TSV package system. The Williams-Landel-Ferry equation and the relaxation modulus function in Prony series are used to characterize the viscoelasticity that is both temperature-dependent and time-dependent. The finite element model subjected to a thermal cycle consists of a four-layer...
Molded underfill (MUF) process for system in package with WLCSP package with cu pillar bump would be the future application in SIP module assembly due to small form factor and low cost of WLCSP and good electrical, thermal performance, fine pitch and lower cost of cu pillar bump. However, higher stiffness of cu pillar could cause interface fracture between cu pillar and solder bump during SMT process...
This paper presents a study of the influences of DBC metal trace layout on the reliability of the high power IGBT module. The research is conducted on a seven-layer IGBT package model using finite element analysis simulation. A parametric study is carried out at different temperatures to simulate the thermal-cycling scenario. It shows in simulation that both total deformation and thermal stress are...
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