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IEEE Transactions on Instrumentation and Measurement > 2017 > 66 > 6 > 1372 - 1378
IEEE Systems Journal > 2017 > 11 > 2 > 562 - 577
IEEE Transactions on Dielectrics and Electrical Insulation > 2017 > 24 > 3 > 1931 - 1937
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 6 > 838 - 845
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 2 > 355 - 363
IEEE Transactions on Magnetics > 2017 > 53 > 6 > 1 - 4
IEEE Transactions on Applied Superconductivity > 2017 > 27 > 4-3 > 1 - 4
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 2 > 331 - 339
IEEE Transactions on Electron Devices > 2017 > 64 > 6 > 2675 - 2682
IEEE Wireless Communications Letters > 2017 > 6 > 3 > 358 - 361
IEEE Transactions on Nuclear Science > 2017 > 64 > 6-1 > 1415 - 1419
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 6 > 829 - 837
IEEE Transactions on Electron Devices > 2017 > 64 > 6 > 2629 - 2634
IEEE Transactions on Transportation Electrification > 2017 > 3 > 2 > 508 - 519
IEEE Microwave and Wireless Components Letters > 2017 > 27 > 6 > 566 - 568
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 6 > 1906 - 1918
IEEE Transactions on Applied Superconductivity > 2017 > 27 > 4-2 > 1 - 5
IEEE Transactions on Applied Superconductivity > 2017 > 27 > 4-3 > 1 - 5
IEEE Transactions on Magnetics > 2017 > 53 > 6 > 1 - 4
IEEE Transactions on Magnetics > 2017 > 53 > 6 > 1 - 4