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IEEE Transactions on Components, Packaging and Manufacturing Technology > 2012 > 2 > 4 > 634 - 649
IEEE Sensors Journal > 2011 > 11 > 4 > 913 - 919
IEEE Transactions on Device and Materials Reliability > 2011 > 11 > 1 > 35 - 43
IEEE Transactions on Power Electronics > 2011 > 26 > 12 > 3948 - 3963
IEEE Transactions on Magnetics > 2011 > 47 > 10 > 3829 - 3832
IEEE Transactions on Applied Superconductivity > 2011 > 21 > 3-3 > 3025 - 3028
IEEE Transactions on Electron Devices > 2011 > 58 > 3 > 782 - 791
IEEE Transactions on Electron Devices > 2011 > 58 > 2 > 279 - 287
IEEE Transactions on Industrial Electronics > 2011 > 58 > 10 > 4931 - 4941
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 3 > 299 - 309
IEEE Transactions on Dielectrics and Electrical Insulation > 2011 > 18 > 2 > 418 - 424
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 5 > 695 - 704
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 5 > 660 - 672
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 10 > 1497 - 1507
IEEE Journal of Quantum Electronics > 2011 > 47 > 7 > 989 - 996
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 12 > 2005 - 2017
IEEE Transactions on Instrumentation and Measurement > 2011 > 60 > 5 > 1674 - 1681
Ieee transactions on components and packaging technologies > 2010 > 33 > 3 > 621 - 628
IEEE Transactions on Applied Superconductivity > 2010 > 20 > 6 > 2360 - 2369
IEEE Transactions on Dielectrics and Electrical Insulation > 2010 > 17 > 5 > 1378 - 1384