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IEEE Transactions on Dielectrics and Electrical Insulation > 2015 > 22 > 1 > 482 - 487
IEEE Transactions on Dielectrics and Electrical Insulation > 2015 > 22 > 1 > 488 - 494
IEEE Photonics Technology Letters > 2014 > 26 > 1 > 18 - 21
IEEE Transactions on Applied Superconductivity > 2014 > 24 > 3 > 1 - 5
IEEE Transactions on Device and Materials Reliability > 2014 > 14 > 1 > 413 - 417
IEEE Transactions on Plasma Science > 2014 > 42 > 6-2 > 1807 - 1810
IEEE Transactions on Electromagnetic Compatibility > 2014 > 56 > 5 > 1178 - 1184
IEEE Transactions on Electron Devices > 2014 > 61 > 8 > 2854 - 2858
IEEE Transactions on Dielectrics and Electrical Insulation > 2014 > 21 > 4 > 1506 - 1515
IEEE Transactions on Device and Materials Reliability > 2014 > 14 > 2 > 698 - 703
IEEE Transactions on Applied Superconductivity > 2013 > 23 > 3-3 > 6602504
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2013 > 3 > 3 > 459 - 466
IEEE Transactions on Dielectrics and Electrical Insulation > 2012 > 19 > 6 > 2145 - 2154
IEEE Transactions on Device and Materials Reliability > 2012 > 12 > 2 > 225 - 232
IEEE Transactions on Electron Devices > 2012 > 59 > 8 > 2033 - 2036
IEEE Transactions on Plasma Science > 2012 > 40 > 9 > 2290 - 2295
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2012 > 2 > 4 > 650 - 659
IEEE Transactions on Device and Materials Reliability > 2012 > 12 > 2 > 255 - 262
IEEE Journal of Photovoltaics > 2012 > 2 > 1 > 27 - 34