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IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 10 > 1589 - 1597
IEEE Electron Device Letters > 2014 > 35 > 7 > 783 - 785
IEEE Transactions on Electron Devices > 2014 > 61 > 6 > 2119 - 2124
IEEE Transactions on Reliability > 2014 > 63 > 2 > 523 - 533
IEEE Transactions on Electron Devices > 2014 > 61 > 5 > 1307 - 1315
IEEE Transactions on Electron Devices > 2014 > 61 > 4 > 1109 - 1115
IEEE Electron Device Letters > 2014 > 35 > 8 > 844 - 846
IEEE Transactions on Device and Materials Reliability > 2014 > 14 > 4 > 1041 - 1048
IEEE Transactions on Affective Computing > 2014 > 5 > 4 > 391 - 405
IEEE Transactions on Device and Materials Reliability > 2014 > 14 > 4 > 942 - 950
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control > 2014 > 61 > 8 > 1329 - 1334
Journal of Display Technology > 2014 > 10 > 11 > 975 - 978
IEEE Transactions on Device and Materials Reliability > 2014 > 14 > 2 > 657 - 663
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control > 2014 > 61 > 12 > 2153 - 2157
IEEE Transactions on Electron Devices > 2014 > 61 > 3 > 825 - 830
IEEE Transactions on Dielectrics and Electrical Insulation > 2014 > 21 > 1 > 179 - 185
IEEE Transactions on Microwave Theory and Techniques > 2014 > 62 > 2 > 297 - 305
Journal of Microelectromechanical Systems > 2014 > 23 > 6 > 1252 - 1271
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 2 > 240 - 247
Journal of Microelectromechanical Systems > 2013 > 22 > 6 > 1296 - 1309