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IEEE Transactions on Device and Materials Reliability > 2012 > 12 > 2 > 272 - 284
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2012 > 2 > 4 > 617 - 624
IEEE Transactions on Electron Devices > 2012 > 59 > 3 > 610 - 620
IEEE Transactions on Magnetics > 2011 > 47 > 5 > 1402 - 1405
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 11 > 1774 - 1789
IEEE Sensors Journal > 2011 > 11 > 9 > 1861 - 1871
IEEE/ASME Transactions on Mechatronics > 2011 > 16 > 1 > 102 - 107
IEEE Transactions on Industrial Electronics > 2011 > 58 > 9 > 4196 - 4206
Journal of Microelectromechanical Systems > 2011 > 20 > 3 > 555 - 557
IEEE Transactions on Power Electronics > 2011 > 26 > 11 > 3215 - 3229
IEEE Transactions on Electron Devices > 2011 > 58 > 6 > 1614 - 1619
IEEE Transactions on Visualization and Computer Graphics > 2011 > 17 > 10 > 1487 - 1498
IEEE Transactions on Electron Devices > 2011 > 58 > 8 > 2743 - 2751
IEEE Transactions on Electron Devices > 2011 > 58 > 8 > 2721 - 2728
IEEE Transactions on Biomedical Engineering > 2011 > 58 > 12-2 > 3456 - 3459
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control > 2011 > 58 > 12 > 2504 - 2515
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control > 2011 > 58 > 12 > 2588 - 2595
IEEE Transactions on Visualization and Computer Graphics > 2010 > 16 > 6 > 1281 - 1290
IEEE Transactions on Dielectrics and Electrical Insulation > 2010 > 17 > 4 > 1043 - 1049