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We present a microfluidic MEMS device that is capable of switching among different states, thus behaving as an effective flip-flop. The devices consist of linear microfabricated deLaval nozzles with three exit channels, and we analyze the response as a function of input and output pressures, feed gas, and dimensions. In all cases, we have seen the appearance of a vortex, whose direction of swirl changes...
This paper presents an innovative, uncomplicated and inexpensive method based on a glass reflow process to fabricate glass-embedded passives for RF MEMS packaging. Experimental results show that various glass-embedded passives, including annular cylindrical and coaxial cylindrical conductive through-holes, plate and coaxial torus trench capacitors, square spiral, circular spiral and meander trench...
We present a generic three-dimensional (3-D) integration method to fabricate suspended single crystalline silicon (SCS) MEMS arrays on CMOS. The method is based on transferring the SCS device layer of SOI on the top of CMOS. For general purpose, thin MEMS arrays with long supporting arms are demonstrated. The fabrication process is clarified in details. Mechanical reliability of the suspended structure...
In this work, an oxide-refill process is used to null the first-order temperature coefficient of frequency (TCF) of silicon MEMS resonators and to achieve high thermal resistance isolation structures. The technology enables fabrication of a low-power ovenized micro-platform on which multiple MEMS devices can be integrated. The intrinsic frequency-temperature characteristic of two resonators is utilized...
Research on MEMS Resonators began over 50 years ago. In just the last 10 years, there has been a series of important technological developments, and (finally!) success at commercialization. The presentation will highlight some key milestones along this path, describe some of the critical technology steps, and outline some of the important non-technological events within SiTime - all of these factors...
In this paper, we report parametric drive of a MEMS rate integrating gyroscope for reduction of drifts induced by drive electronics. A Toroidal Ring Gyroscope (TRG) with 100k Q-factor at 1760 µm diameter was fabricated in epitaxial silicon encapsulation (EpiSeal) process. Device was operated in rate integrating mode using a FPGA based control system. In contrast to the conventional amplitude control...
We experimentally demonstrate a low-power MEMS tunable photonic ring resonator with 10 selectable channels for wavelength selection in reconfigurable optical networks operating in the C band. The tuning is achieved by changing the geometry of the slot of a silicon slot-waveguide ring resonator, by means of vertical electrostatic parallel-plate actuation. Our device provides static power dissipation...
We propose a new approach for integration of electrodes as a part of the micro glass-blown spherical resonator fabrication process as well as an ALD metallization of the inner side of the spherical shell enabling electrostatic conduction. We use a 500µm thick silicon electrode whose electrostatic gap width, defined during the glass blowing process, is not limited by lithographic effect and enables...
We report an approach to suppress anchor loss in thin-film piezoelectric-on-silicon (TPoS) micromechanical (MEMS) resonators by patterning 2D phononic crystals (PnCs) externally on the anchors. The PnCs serve as a frequency-selective reflector for outgoing acoustic waves through the tethers of the TPoS resonator. According to our experimental results, combining the PnCs with the conventional TPoS...
This work presents chip-scale integration of MEMS resonant mass balances along with aerosol inertial impactors (airborne micro/nanoparticle collectors). A three mask microfabrication process has been developed to produce the main components; mass balance, impactor nozzle, and impaction micro-chamber on a single SOI substrate. In addition to extreme miniaturization of a conventionally bulky setup and...
This paper presents the Modeling of Silicon capacitive pressure sensor for biomédical applications. Using the Micro Electro Mechanical Systems (MEMS) technology, MEMS sensors are widely used in biomédical applications due to its advantages of miniaturization, low power consumption, easy to measurement and telemetry. This work demonstrates the design of MEMS based capacitive pressure sensor using finite...
In the present paper, the design and simulation of square diaphragm, MEMS piezoresistive pressure sensor for intracranial application has been presented. The pressure sensor design presented in this paper consists of a carbon nanotube (CNT) suspended on a square and slotted shaped diaphragm as piezoresistor. The slot was added into the design of the square diaphragm to reduce the residual stress and...
In order to clarify the source of resonant frequency drift in MEMS resonators, thermal expansion effect of packaging on MEMS devices was investigated. The strain in a silicon plate bonded on an aluminum plate with temperature was precisely measured. Increasing amount of strain in the aluminum plate was as large as 200 micro-strain with increase in only 20 degrees of temperature. The strain in the...
Piezoelectric microelectromechanical systems (MEMS) resonators on Si can be a potential candidate to replace discrete L-C components in series resonant converters. In this paper, ring shaped piezoelectric (AlN) micro-resonators on Si are reported. Having vibration in contour mode, these resonators can achieve resonant frequency as low as 87.28 MHz. Recently, we have fabricated high Q (>1000) piezoelectric...
This paper presents brief study of MEMS technology and development of condenser microphone with no holes in back plate. In general silicon materials are used in MEMs. MEMS devices can be fabricated by using bulk micromachining and surface micromachining. Microphone is designed by using a thin silicon crystalline material as flexible diaphragm and gold material as back plate. The aim of this paper...
We have successfully obtained a highly c-axis oriented epitaxial Pb(Zr, Ti)O3 (PZT) based thin film, 0.06Pb(Mn1/3, Nb2/3)O3-0.94Pb(Zr0.5, Ti0.5)O3 (PMnN-PZT), on a (100) Si substrate by fast cooling of the substrate just after sputter deposition. The Si substrates were covered with SrRuO3//La0.5Sr0.5CoO3//CeO2//yttria-stabilized zirconia buffer layers. It is found that c-axis orientation ratio of...
Progressive cardiac diseases due to population aging lead to stimulate research and innovation. Moreover, recent development in the miniaturization of microsystem offers a tremendous opportunity for medical implantable application. This paper introduces a new technology that integrates a Micro Electro-Mechanical Systems (MEMS) accelerometer and an Application-Specific Integrated Circuit (ASIC) inside...
MEMS devices require wafer level hermetic encapsulation to protect the delicate moving structures and electrostatic/capacitive transducers from environmental influences. Encapsulation is most often done by bonding a encapsulating wafer to the MEMS wafer. Electrical contacts to the hermetic space are provided in the state of the art MEMS devices by horizontal interconnections across the bonding interface...
In this study, we propose a dual-axis hybrid-MEMS mirror for large-area 2D raster scanner composed of fast and slow driving gimbals. For simple fabrication and high driving performance, an outer gimbal for slow and large scanning has polymer SU-8 hinges with low rigidity, and an inner gimbal for fast scanning has Si hinges with high rigidity. The outer gimbal deflected over ±14deg. at non-resonant...
We perform in-situ sensing of volatile droplet and spray masses using plate-like single crystal Si micro-resonators with low stress, where robust and reusable operation was attained over harsh conditions and over multiple cycles. A home-built electro-optical sensing system has been used. The effects on the resonant frequency of altered mass loading, elasticity and strain are compared, where the latter...
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