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This paper reports a method of measuring the on-chip thermal stress for silicon resonant accelerometer (SRA). This method could be used to evaluate the stress-temperature characteristic of SRA, and that would help to focus the problems exist in SRA. Clamp-clamp Double Ended Turning Fork resonator is used as a basic measurement unit. Analysis of the accuracy and noise in stress measurement is given...
MEMS technology has never been used for a non-imaging wearable ultrasound application, where e.g. lateral resolution is a minor issue. We combine finite element modeling and thin-plate analytic modeling and some measurements on MEMS devices, to optimize the performance of four MEMS layouts for a wearable bladder monitor. An array of square diaphragms, clamped on two sides, appears to be most favorable.
A systematical study is performed to analyze the spurious modes, Q and electromechanical coupling of 1.22 GHz AlN MEMS contour-mode resonators. A total of 135 different geometrical configurations were studied. An unloaded Q of up to 3157, an electromechanical coupling of up to 2.3%, and a figure of merit of up to 61.6 were achieved. In particular, we found that Q is primarily affected by finger length...
In this paper, a TGV interposer based wafer level packaging for inertial MEMS devices is presented. For the TGV interposer, there is a redistribution layer of Al wiring on each side, which are electrically connected with Al metalized TGV. Being as a capping wafer, it's bonded to a MEMS accelerometer wafer based on bulk silicon process with a patterned benzocyclobutene(BCB) layer to achieve wafer level...
According to the analysis of substrate integrated waveguide structure, a design of double-layer and seven-order MEMS bandpass filter using network synthesis is proposed in this paper. The simulation and optimization are explained with Ansoft HFSS. Based on MEMS technology, a millimeter-wave filter is designed with a center frequency at 30GHz, the 1dB bandwidth range is 690MHz, the passband return...
A terahertz (THz) dynamic switch with polarization dependence is proposed with MEMS metamaterial method. The split ring resonators (SRRs) are located on a silicon-on-insulator (SOI) wafer, where the buried oxide (BOX) is etched to let the silicon layer together with the SRRs work as an electromechanical shutter to control the incident THz wave propagation. Electrostatic actuation is employed for the...
This paper proposes an electromagnetic MEMS motor without a winding wire. The developed motor is combined with microelectromechanical systems (MEMS) processing and multilayer ceramic technology, which is used to form a miniature three-dimensional coil inside the magnetic core. The length, width, and height of the developed motor are 11, 11, and 7.5 mm, respectively. The fabricated MEMS motor demonstrated...
A MEMS active optical element delivers dual axis pointing and scanning with dynamic focus control for a handheld in vivo confocal microscope. This paper describes the design, processing steps and preliminary fabrication results of the new device.
Benefits of using TFT (thin film transistor) technology for integrated MEMS is discussed from view points of design rule, device dimension, output voltage, and post-process. TFT-MEMS for biochemical and optical applications are presented.
We present a high resolution and high frame rate (HRHF) Lissajous scanning. The Lissajous scanning was achieved by the selection rule of scanning frequencies, i.e., optimizing the greatest common divisor of transverse driving frequencies and the sum of transverse driving frequency ratios. HRHF Lissajous fiber scanner provides 10 fps with 89.5 % fill factor at driving frequencies of 1000 Hz and 1210...
We demonstrated a MEMS based Monolithic Michelson interferometer with both the movable mirror and fixed mirror vertically oriented and integrated on a silicon bench for the first time. Both mirrors are single-crystal silicon based and their vertical orientation is attained by a proper thermal bimorph design and a unique stopper mechanism. This device enables miniature Fourier transform spectrometers.
High frequency wine-glass mode bulk MEMS resonators actuated by means of capacitive transduction have been fabricated by using solid-gaps based on polyvinylidenefluoride-trifluoroethylene (PVDF-TrFE). The fabrication process flow of patterned PVDF-TrFE gaps applied in RF MEMS is presented for the first time. Measurements of the polarization of the material and the frequency and voltage dependence...
In this paper, we have proposed a 60-GHz air cavity antenna array with checkerboard structure based on the MEMS silicon bulk micromachining technology. A one-to-four power divider with a Si-to-air transition is designed to excite an air-filled cavity antenna array. By properly arranging the four sub arrays, the proposed array is with a checkerboard structure. An in-phase radiating aperture which is...
Optical frequency division based on mode-locked laser frequency combs makes possible the coherent transfer of frequency stability from optical systems to electronics. It has enabled a revolution in time keeping and frequency metrology. In this paper we describe progress on new methods for frequency comb generation including whispering-gallery-based microcombs and electro-optical comb generation. Demonstration...
On-chip integration of quartz resonators with Si devices opens new opportunities for microsystem miniaturization and enhanced performance. In addition to integrating with electronics, the integration of piezoelectric quartz resonators with other sensors of different material composition is also possible. In this paper, we demonstrate that a VHF SC-cut quartz resonator can be integrated within a high-aspect-ratio...
MEMS devices are continuous evolving to achieve smaller size and lower cost with improved performance. The Through silicon via (TSV) technology offers a promising approach from the perspective of MEMS device packaging and integration. In this paper, we report our latest progress on wafer level packaging of MEMS devices by via-last process. The 200mm MEMS wafer was bonded with a glass cap wafer. Then,...
An approach for a low-power chip-scale package is described, that provides a laser output with a programmable frequency across 50 nm of bandwidth centered at 1550 nm, and a resolution of one part in 1014.
This paper focuses on the thermo-mechanical reliability of a 3D-TSV MEMS in which cap layer and MEMS micro-structure layer is vertically interconnected and bonded by TSVs/micro-bumps and a sear ring. Geometrical parameters of the TSV structure and the seal ring are optimized first before the global model simulation. Smaller thickness of bottom TSV Cu and smaller opening size of silicon oxide layer...
In this paper, a novel Si interposer for hermetical MEMS oriented System-in-Package application is presented and it is a low stress, scalable platform with a stress releasing function. It's composed of Si posts which are Air-gapped from Si interposer substituting traditional Copper TSVs to function as electrical interconnection paths, re-distribution layer (RDL) and landing pads for chip stacking...
A simulation methodology dealing with the complexity of multiphysical micro electro mechanical system (MEMS) models and their evaluation according to RF specification is presented. It is focused towards the evaluation of a hybrid MEMS-CMOS RF oscillator prior to its realization, based on the demodulation performance of a long-term evolution (LTE) user equipment (UE). The proposed multiphysical simulation...
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