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In the recent times, due to the high depletion rates of availability of fossil fuels, solar energy is substituting as one of the excellent options for power grid evolution. Any system under operation is susceptible to faults due to internal and external factors. The identification of certain faults not only consumes more time but also leads to wastage of resources due to unwanted maintenance strategies...
A key pathway to meeting the Department of Energy SunShot 2020 goals is to reduce financing costs by improving investor confidence through improved photovoltaic (PV) module reliability. A comprehensive approach to further understand and improve PV reliability includes characterization techniques and modeling from module to atomic scale. Imaging techniques, which include photoluminescence, electroluminescence,...
Solar panel's reliability studies focus mainly on the properties of the encapsulating such as gel content and transmittance, while ignoring the impact of encapsulation process on the solar cells themselves. The harsh lamination conditions apply high temperature and pressure on the wafers, which can induce increased stress, deformation and defects. The investigation of solar cells sealed inside modules...
Various characterization techniques have historically been developed in order to screen potential induced degradation (PID)-susceptible cells, but those techniques require final solar cells. We present a new characterization technique for screening PID-susceptible cells during the cell fabrication process. Illuminated Lock-In Thermography (ILIT) was used to image PID shunting of the cell without metallization...
The purpose of this paper is to explore the key factors affecting consumer's use behavior on financial products similar to Yu'e Bao. Considering the financial market and policy environment in China, theoretical model is founded based on extending Unified Theory of Acceptance and Use of Technology (UTAUT) and the hypotheses are put forward. Then, to test the model and hypotheses, 199 valid data is...
Wide-bandgap (WBG) semiconductors have attracted great attention as materials for the next-generation power devices since they have superior material properties compared to silicon (Si). The most advanced WBG semiconductor for power devices is silicon carbide (SiC). In 1987, the growth technology called “step-controlled epitaxy”, which enables single-phase (polytype) growth, was developed. In 1993–1994,...
Integrating and processing data that reside in different legacy systems remains an often laborious process, requiring either manual steps or complicated programming yet legacy systems when used in silos make the sharing of information, security and management controls a nightmare. Such fragmentation of data leads to challenges of system processing inefficiencies, poor synchronization of reports, delayed...
This paper develops a new principled frameworkto solve a hardness-aware truth discovery problem in socialsensing applications. Social sensing has emerged as a new applicationparadigm where a large crowd of social sensors (humansor devices on their behalf) are recruited to or voluntarily reportobservations about the physical environment at scale. Theseobservations may be either true or false, and hence...
This paper reports on the development of packaging technology for the assembly of 30µm pitch micro Cu pillar bump (15µm diameter) on organic FCCSP substrate having bare Cu bondpad without NiAu or OSP surface protection. The assembly was performed by thermal compression bonding (TCB) with non-conductive paste (NCP). Finite element modeling and simulation were carried out to understand the Cu pillar...
This paper reports direct in-situ stress measurements with microscale spatial resolution in glass using Raman spectroscopy. This new technique is used to assess the reliability of copper-plated laser-drilled through package vias (TPV) in ultra-thin bare glass interposers. Bare glass panels of 3"x3" size, with 137µm and 237µm thicknesses were fabricated with laser-drilled through-package...
In recent years, the 2.5D IC (Integrated Circuit) package with TSV (Through Silicon Vias) has become important for high-bandwidth and high-performance applications. It is well known that 2.5D technology requires significant innovation in the areas of process technology, packaging, design, thermals, and test solutions leading to several hundred new technologies in a single product. With these complex...
MEMS devices are continuous evolving to achieve smaller size and lower cost with improved performance. The Through silicon via (TSV) technology offers a promising approach from the perspective of MEMS device packaging and integration. In this paper, we report our latest progress on wafer level packaging of MEMS devices by via-last process. The 200mm MEMS wafer was bonded with a glass cap wafer. Then,...
Increasing needs for functionality, performance and system miniaturization in fine-pitch consumer applications have been driving a new class of ultra-thin interposers and packages with larger body sizes, aggravating warpage. These trends gave rise to serious concerns for assembly yield and reliability, especially at board level. The recent adoption of substrate technologies with silicon-matching coefficient...
The advancement of Si and flip chip package technologies are driven by high performance mobile processors with high I/O counts. In Si, the back-end-of-line (BEOL) copper interconnect with extreme low-K (ELK) dielectrics has been used to lower RC latency. While for packages, fine-pitch Cu bump is introduced to meet the high I/O density. Corresponding assembly solutions such as thermal compression bonding...
This paper focuses on the thermo-mechanical reliability of a 3D-TSV MEMS in which cap layer and MEMS micro-structure layer is vertically interconnected and bonded by TSVs/micro-bumps and a sear ring. Geometrical parameters of the TSV structure and the seal ring are optimized first before the global model simulation. Smaller thickness of bottom TSV Cu and smaller opening size of silicon oxide layer...
The emergence and evolution of any package technology is driven by market trends as experienced by the end application. With the maturation of the mobile market, the trends for Smartphone and other mobile devices are more than ever for lower cost. Meanwhile, a higher degree of functionality and performance, thinner profile, and longer battery life are some of the additional market drivers seen in...
The solder joint reliability under thermomechanical fatigue is a very strong function of package size and thermal expansion mismatch for a large ceramic leadless chip carrier package (CLCC) with perimeter I/O. If these factors cannot be adjusted, the design space for successful implementation of such a package becomes drastically small. We discuss the reliability improvement methodology where the...
Social sensing is a new application paradigm of cyber-physical-social systems (CPSS), where a group of individualsvolunteer to report their claims about the physicalenvironment using cyber devices. A fundamental problem insocial sensing application is to ascertain source reliability andthe claim correctness without knowing either of them a priori, which is referred to as truth finding. Several key...
Silicon Physically Unclonable Functions (SPUFs) are delay based PUFs that exploit stochastic manufacturing process variations of Integrated Circuits (ICs) on silicon chips to construct unclonable cryptographic secret keys which are unique for each chip. One variant of SPUFs, named Ring Oscillator (RO) PUFs, is typically used for the authentication of silicon technology devices including FPGA chips...
In this paper, we propose a novel lifetime reliability-aware resource management approach for many-core architectures. The approach is based on hierarchical architecture, composed of a long-term runtime reliability analysis unit and a short-term runtime mapping unit. The former periodically analyses the aging status of the various processing units with respect to a target value specified by the designer,...
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