The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
For mobile applications, advanced silicon technology nodes are using Back End Of Line (BEOL) stacks with Ultra Low-k (ULK) materials. Employing these ULK materials in combination with advanced Flip Chip (FC) packages requires a profound understanding of the chip package interaction (CPI). To match high I/O and reduced pitch requirements, Cu pillars are widely used as first level interconnect technology...
In this study, a micro tensile test method that can measure the interface strength of a grain boundary has been developed by applying an EBSD (Electron Back-Scatter Diffraction) method and a FIB (Focused Ion Beam) system, and it was applied to evaluate the effect of the crystallinity of a grain boundary on the strength of electroplated copper thin films quantitatively. The position and crystallinity...
Silver sintering is a potential die attach technology to replace the solder technology for power electronic systems. A design of experiments (DoE) is performed in order to investigate the influences of sinter parameters as sinter pressure, temperature, duration, drying temperature and the interactions of these parameters on the shear strength of the Ag-sinter connection. Four sinter pastes have been...
This paper describes the design, construction and performance of a 5 kVA aviation power module containing silicon carbide MOSFETs. The function and control of this module within a commercial aviation power electrical control unit (ECU) application is explained and the power dissipation benefits from the use of these MOSFETs instead of silicon IGBTs when driving an electrical motor controlling an aileron...
In this work we demonstrate, for the first time, the advantages of GaN HEMTs on bulk GaN substrates over similarly processed devices on Sapphire and Silicon substrates, intended for power applications, in terms of on-state and off-state operation as well as reliability, where self-heating, off-state leakage, and trapping effects are minimal. MIS-HEMTs with breakdown voltage of ∼670 V and off-state...
In real time systems, random caches have been proposed as a way to simplify software timing analysis, by avoiding corner cases usually found in deterministic systems. Using this random approach, one can obtain an application's probabilistic Worst Case Execution Time (pWCET) to be used for timing analysis. As with deterministic systems, technology scaling in cache memories is making transient and permanent...
this paper addresses the study of the variable failure rate of high-voltage circuit breaker by using the Weibull distribution method to set time-based maintenance schedule properly. Power circuit breaker is installed in the substation in varied configurations, the case study for compared with, Main and Transfer bus arrangement, and Breaker and A Half bus arrangement. These are used more in substation...
The evolution of silicon and silicon-germanium pnp transistors is reviewed in this paper. The motivation for SiGe-pnp transistors in Complementary Bipolar (CBi) and CBiCMOS is discussed with a view on device parametric parameters that help gage the usefulness of these devices in analog and RF design. We review the basic process architectures and process building blocks for CBiCMOS. SiGe-pnp versus...
We investigated why the blocking voltages of a power device are lowered during a durability test through a device simulation called Technology Computer Aided Design (TCAD) and measurements using the optical beam induced current (OBIC) method. We found that the spread of the depletion layer caused by the bonding wire is what decreased the blocking voltage.
The paper considers the issues of burning metal jumpers on the surface of a semiconductor by current pulses of different shapes. Discovered that the passage of single rectangular current pulse with a duration of no more than 60 μs and an energy of 90 mJ observed the predominance of the processes of melting metal film over the contact melting at the interface. Current pulses of non-rectangular form...
Haze removal, which is also referred to as image dehazing, has been extensively used to improve the visibility in images captured under inclement weather. In particular, the dark channel prior (DCP)-based single image dehazing has received the greatest amount of interest due to its superior performance. However, since the DCP is based on the characteristics of natural outdoor images, its reliability...
As known to all, photometric and colorimetric quality of LED illumination mainly depends on LED chip, phosphor and sealant. The investigation on failure mechanism of the three parts carries critical meanings for improving reliability of LED production. This paper mainly focus on reliability and failure mechanism of the three kinds of phosphor and three kinds of sealant which are wildly used in high...
Through Silicon Via(TSVs) technology is one of the most prominent feature in future microelectronic devices packaging. Since TSVs contain the interfaces of heterogeneous materials that have high CTE mismatch, and would hence produce large thermal stresses under temperature loading, often leading to mechanical failure. A failure stress mathematical model is established and the algorithm of mathematical...
The Clech Algorithm is an approximate method for the prediction of the stress state and damage of solder joints of electronics components such as Flipchip, Ball Grid Array that are undergone time dependent temperature load. It can be used to predict the reliability of solder joint under temperature cycling conditions. In this work, the application of this algorithm has been described and applied to...
The trends for smartphone and other mobile devices are more than ever for integration and lower cost. Meanwhile, a higher degree of functionality and performance, thinner profile, and longer battery life are some of the additional market drivers seen in these devices. The implications of these market drivers on the packaging content of mobile devices including internet of things (IoT) and wearable...
Moisture absorption of epoxy mold compounds (EMC) from IC packages is a serious concern especially for their reliability performance during stress tests. Numerous studies reported the popcorn cracking delamination due to moisture absorption of packaging materials during solder reflow [1]. Though no pop-corn delamination or other EMC to die pad delamination happened at time zero, current leakage may...
The implementation of Management Information Systems (MIS) in educational management and administration is a relatively innovative field which is rapidly evolving because of its high efficiency and effectiveness. There is a relatively small number of research studies reported in the literature evaluating MIS implementations in universities. This case study focuses on the post-implementation evaluation...
Providing reliable explanations for the causes of an access response represents an important improvement of applications usability and effectiveness, in a context where users are permitted or denied access to resources. I present an approach composed by two different procedures, both relying on OWL-DL and SWRL Rules, in order to generate policy explanations. The first procedure makes use of OWL Explanation...
Physically Unclonable Functions (PUFs) were introduced over a decade ago for a variety of security applications. Silicon PUFs exploit uncontrollable random variations from manufacturing to generate unique and random signatures/responses. Existing research on PUFs has focused on either PUF design at the architectural level or optimization of lithography to increase sensitivity to random process variations...
High compression ratio is crucial to cope with the large amounts of data produced by telemetry sensors and the limited transmission bandwidth typical of space applications. A new generation of telemetry units is under development, based on Commercial Off-The-Shelf (COTS) components that may be subject to misbehaviors due to radiation-induced soft errors. The purpose of this paper is to study the impact...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.