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To attain high bandwidth communication between chips at lower power consumption, silicon interposers with dense metallization and through-silicon vias (TSVs) have been widely explored. However, TSV electrical losses increase as TSV height increases and are generally high in low-resistivity silicon. To alleviate this issue, we demonstrate a silicon interposer technology featuring photodefined polymer...
In the study, we report for the first time a novel concept for the mitigation of the TSV-induced stress on the CMOS device performance. This solution consists in selectively integrating an airgap at the time of via-middle TSV processing. In addition to the expected benefits in term of stress management, this new approach is also cost effective, as the TSV processing steps, such as deep silicon etching,...
This paper presents the first demonstration of polycrystalline silicon interposers with fine pitch through package vias (TPV), with less than 5μm RDL lithography at 50μm pitch copper microbump assembly. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wiring offer compelling benefits for 2.5D and 3D system integration; however, they are limited by high cost and high...
We present the design of a bilayer metallic wire-grid polarizer (WGP) optimized for operation in the deep-ultraviolet (DUV) region, and their high-throughput fabrication of over large areas by nanoimprint lithography (NIL). The master imprint stamps were fabricated using our newly developed scanning exposure strategy with extreme ultraviolet interference lithography (EUV-IL). Optical measurements...
To improve the performance of MEMS device, it is critical that the effect of environmental parameters on these devices be controlled or eliminated. In this paper, we first developed a novel technique by employing thermal actuator and actuators array to rectify the micro deformation of MEMS substrate due to thermal mechanical stress as a result of temperature variation. This PTAA consisting of a 50...
The fabrication of precise hemispherical shape is challenging with standard planar lithography techniques. A suitable alternative is the fabrication by inkjet printing. This paper presents a method based on drop-on-demand inkjet printing on pre-patterned silicon substrates allowing the controlled fabrication of SU-8 hemispherical cup-like structures with inner cavities of sub-nano-liter volumes. Examples...
This study presents a novel design and fabrication process to realize an on-chip micro ball bearing. The ball bearing consists of a polymer-Si-polymer outer-race (stator), and a suspended polymer-Si-polymer inner-disk (rotor) supported by polymer micro-balls. The outer-race and inner-disk are demolded from silicon mold, which is patterned by wet isotropic etching on double-polished 525 µm-thick silicon...
Wafer-bonding-based integration can be rapidly and easily tested between different types of devices by wafer-to-wafer flip-chip transfer technology described in this paper. Devices to be tested (e.g. MEMS) on a support wafer are bonded and electrically connected with a target wafer (e.g. LSI) using sticky silicone bumps, and then any of the devices are selectively debonded from the support wafer by...
Thin wafer handling is an important issue in 3D integration technologies. This paper reports on an efficient method for bonding a thin wafer and debonding it at room temperature from a carrier wafer. This method addresses the major problem of fragility and flexibility in handling of thin wafers used in TSV fabrication. In the presented method the carrier wafer is spin coated with an electrochemically...
We demonstrate, for the first time, the use of off stoichiometry thiolene-epoxy, OSTE(+) for adhesive wafer bonding. The dual cure system, with an initial UV-curing step followed by a second thermal cure, allows for high bond strength and potentially high quality material interfaces. We show that cured OSTE(+) is easily removed in oxygen plasma and that the characteristics of OSTE(+) make it a potential...
Nanostructured polymer surfaces with optical functionality are fabricated by up-scalable methods, nanoimprinting and injection moulding. The fabrication and performance of nanostructured polymer surfaces with anti-reflective functionality are discussed.
We demonstrate a band engineered slot photonic crystal waveguide refilled with electro-optic (EO) polymer. The combined effects of slow-light and high performance EO polymer makes possible effective in-device r33 of 1012pm/V and Vπ×L of 0.345Vmm.
In this study, nano-porous membrane of silicate hydrogel was developed as a separator wall of nanometer-sized bioreactor chambers. Thin silicate polymer membrane was fabricated on a silicon support structure by spin coat technique. Monomer concentration and pH of silicate reaction mixture was investigated to obtain appropriate porosity and mechanical strength of the membrane. The silicate gel membrane...
Current paper introduces efficient silicon wire waveguide crossing by means of vertical coupling of tapered Si wire with upper SU-8 polymer wide strip waveguide through a silica buffer. Numerical 3D simulations by FDTD proves that optimal structure of 70 μm length provided 98% efficiency for through pass and 99.9% efficiency for cross pass as well as negligible back reflection (−50 dB) and cross talk...
With wireless applications flourish like mobile phone, consumer end products must tend to small form factor development. More functions, less dimension, and high integration are future technology trend in chip package development roadmap. Integrated Passive Device (IPD) has these advantages in SiP and 3DIC applications. IPD technology can integrated more passive circuits/components in one IPD die...
Novel composites performing both dielectric and mechanical functions have a potential application in vehicle structures of both energy storage and load bearing capacity, leading to reduction in weight and associated energy costs. Multifunctional silicon nanoparticles/bisphenol E cyanate ester (Si/BECy) nanocomposites were synthesized and their dielectric properties were investigated. Si nanospheres,...
Sandwiching a photosensitive layer of As2S3 between Si core and polymer cladding enables trimming of athermal waveguides. Moreover, athermal operation enables the compensation of thermal effects related to Si nonlinearity with respect to standard waveguides.
Contamination flashover is a major concern affecting the reliability of power systems. Many utilities have switched over from porcelain and glass insulators to Silicon Rubber (SIR) based polymeric insulators to combat contamination problem. By and large, Aluminum Tri-hydrate (ATH) is used as filler material to improve the tracking and erosion property. The evaluation as per IEC 60587 does not simulate...
In this contribution we present a new and efficient technique for post-fabrication trimming of chalcogenide (ChG) based photonic integrated circuits (PICs). The technique exploits the high photosensitivity of As2S3 glass to visible light radiation in order to induce a variation in the refractive index of the material, and therefore in the optical properties of ChG-based devices. The trimming technique...
This paper presents experimental results obtained on the tracking and erosion resistance of silicone rubber (SIR) with two different nano fillers. Further, the chemical and morphological changes that silicone composite is likely to have undergone during inclined plane tracking and erosion test (IPTET) studied by employing FTIR spectroscopy, Scanning Electron Microscopy and EDAX techniques are discussed...
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