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Flame-retardant ethylene propylene diene copolymer (FR-EPDM) and silicone rubber (SiR) were aged by heat with or without concurrent irradiation of gamma rays. For these samples, chemiluminescence (CL) and infrared absorption spectra were measured. Although the CL intensity decreases with an increase in total dose of gamma rays both in FR-EPDM and SiR, this negative dose-dependence is weaker in FR-EPDM...
The micro-hybrid system in foil (HySiF) involves ultra-thin chips embedded and interconnected in polymer foil for diverse flexible electronic applications. In this paper, the concepts and results of wafer level embedding and interconnection of ultra-thin dies in polymers are presented. The significant achievement of the presented HySiF is the accurate interconnection between a pair of functional chips...
In the past decade, rare-earth-doped and also transition-metal-doped dielectric waveguides have emerged as highly efficient laser devices. This paper reviews the results in Ti:Sapphire, polymer, sesquioxides, amorphous aluminium oxide, and potassium double tungstates that have recently been obtained in our research group, partly in collaboration with other research groups.
This work presents the theoretical analysis of the effects of dielectric relaxation on the response of polymer piezoelectric sensors. In systems that obtain spatial information from temporal signals, such as optoacoustic tomography, the accurate characterization of transducers is very important. There are many works in the literature about reconstruction algorithms assuming ideal piezoelectric sensors...
In this paper, we present a high speed electro-optic directional coupler switch based on horizontal Si-polymer-metal hybrid plasmonic waveguide. Simulation results show that the speed of higher than 1 THz could be reachable. The overall length and insertion loss of optical switch are ∼ 24 μm and 1.5 dB, respectively, with the drive voltage of ±2 V.
In this paper we propose a high speed, low energy consumption, Mach-Zehnder interferometer modulator. Bend-less three-waveguide directional couplers are employed as splitter/combiner to diminish the overall footprint while keeping the insertion loss of the structure negligible. Si-polymer-metal hybrid plasmonic waveguide is used for the Mach-Zehnder arms where the phase shift will occur. Strong confinement...
Sharp electrically conductive structures integrated into micro-transfer-print compatible components provide an approach to forming electrically interconnected systems during the assembly procedure. Silicon micromachining techniques are used to fabricate print-compatible components with integrated, electrically conductive, pressure-concentrating structures. The geometry of the structures allow them...
This paper reports direct in-situ stress measurements with microscale spatial resolution in glass using Raman spectroscopy. This new technique is used to assess the reliability of copper-plated laser-drilled through package vias (TPV) in ultra-thin bare glass interposers. Bare glass panels of 3"x3" size, with 137µm and 237µm thicknesses were fabricated with laser-drilled through-package...
Through silicon vias (TSV) are the enablingcomponents in the emerging 2.5D and 3D integrationmicroelectronic packaging. The insulation layer, i.e. the liner, plays the key role in determining the performance of TSV. Polymer liner are receiving a growing attention for its moresuitable properties and simpler processing compared to thetradition silicon dioxide (SiO2) liner. Recently we reported anovel...
Low cost through silicon via (TSV) technology is a key enabler for the future performance growth of various semiconductor devices. Deep etching and solder filling for TSV through pre-stacked silicon wafers make the TSV process much simpler. Polymer insulator also contributes to stress reduction and conformal insulation. In this paper, we investigate the barrier effect of polymer insulators on metal...
Modeling and controlling of warpages and layout-dependent local-deformations are challenges to overcome to realize 3D stacking of dies with through-silicon vias and micro-bumps. Dies larger than about 500 mm2 are now being used for high performance computing, and large cylindrical warpage of the die and local die surface deformations can greatly affect the yield and reliability of the stacked dies...
This paper demonstrates silicon-integrated, thinfilm, high-density tantalum capacitors for integrated power modules. The capacitors in form-factors of less than 75µm showed stable capacitance densities of more than 0.3 µF/mm2 with leakage of less than 0.1 µA/µF at 3 V. To the best of authors' knowledge, this is the highest capacitance density reported till date at the mentioned form-factors. Furthermore,...
Deep Reactive Ion Etch (DRIE) processes used to form Through Silicon Vias (TSVs) achieve high aspect ratios by depositing polymer on the vertical sidewalls of the features. This polymer material must be removed before other materials (including dielectric liner, Cu barrier, and Cu) are deposited in the TSVs. Clean processes adapted from Cu damascene integration flows use a combination of oxygen ash...
This paper presents buckled nitride thin-film encapsulation using anti-adhesion layer assisted transfer technique and BCB/nitride bilayer wrinkling due to elastic property mismatch between the two attached materials. A 900 nm silicon nitride film is deposited on a Si carrier wafer coated with hydrophobic monolayer and then non-patterned nitride film is directly bonded to BCB sealing rings prepared...
All CMOS modulator based on directional coupler configuration is presented, simulated, and analyzed. The device structure utilizes the silicon-organic hybrid platform. The waveguides are made of arrays of silicon nanowires on a bulk silicon dioxide substrate. While the cladding and the voids between the silicon nanowires are filled with an electro-optic polymer. When the voltage applied across the...
This paper reports recent advances related to the piezoelectric oxide semiconductor field effect transistor (POS-FET) based touch sensing system research. We reported in past, the POSFETs with basic electronics realized on planar silicon substrates using CMOS technology. However, the planar POSFETs could not be used on 3D or curved surfaces such as the fingertip of a robot. To overcome this challenge...
A novel inspection technology for detection of thin polymer layers, deposited on structured silicon wafer surfaces, has been developed. The labeling of polymer residues with fluorophore combined with the subsequent examination under a fluorescence microscope enables a non-destructive detection of amorphous and semi-crystalline polymers and polymer residues on wafer substrates.
Etch is one of the most critical processes for high-aspect ratio TSV as it defines the profile and wafer level depth uniformity of TSV, thus having a great impact on other downstream processes in TSV module and TSV backside reveal. This paper presents the challenges encountered in developing the 6μm × 55μm TSV (6μm diameter × 55μm depth) with a number of continuous process optimizations. These include...
In this paper, we have proposed a spray coating method for electret material deposition. With this method, the thickness of electret can be well controlled and the surface potential of the charged electret can be improved comparing to the traditional spin coated polymer electrets. Furthermore, we have added some polystyrene nano particles into the electret, which can improve the surface charge stability...
In this paper, we investigated the reliability test for Glass interposer. The test vehicle is assembled glass interposer with chip, BT substrate, and PCB. The structure of a glass interposer with two RDL on the front-side and one RDL on the backside had been evaluated and developed. Key technologies, including via fabrication, topside RDL formation, micro-bumping, temporary bonding, silicon and glass...
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