Sharp electrically conductive structures integrated into micro-transfer-print compatible components provide an approach to forming electrically interconnected systems during the assembly procedure. Silicon micromachining techniques are used to fabricate print-compatible components with integrated, electrically conductive, pressure-concentrating structures. The geometry of the structures allow them to penetrate a polymer receiving layer during the elastomer stamp printing operation, and reflow of the polymer following the transfer completes the electrical interconnection when capillary action forces the gold-coated pressure-concentrator into a metal landing site. Experimental results and finite element simulations support a discussion of the mechanics of the interconnection.