The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The original purpose of the Re-Distribution Layers(RDL) was to assist in the adaption of metal bumping and flipchip packaging technologies, by the addition of the metal anddielectric layers onto the wafer surface to re-route the legacydesigned irregular peripheral I/O layout, into a new area arraybond pads layout to facilitate a balanced metal bumps and flipchip bonding. The redistribution layer technology...
Here we present the fabrication process for silicon-in-glass electrodes as capacitive transducers. The embedded electrodes are formed by utilizing a glass reflow process. DRIE process easily defines the number and shape of these embedded silicon electrodes. Eight, sixteen, twenty-four electrodes are obtained through this process. These silicon-in-glass electrodes are anticipated to be operated to...
Throughput issue is limiting the adoption of 3D IC stacking process although 3D IC has many advantages in shorter communication lines, lower electrical parasitic and lower package footprint. Local thermal compression bond on each chip stack incurs enormous process time if there is a need to have multi-chip stack and it will be further complicated with the enormous number of chip stack on one 12"...
In order to remove the photoresist during the rework process, a dry rework is primarily used to ash the photoresist followed by a wet cleans process to remove the remaining organic residues. An effective process with very high particle removal efficiency (PRE) is desired at this surface cleaning step. A cleans process with lower PRE leaves particles on the wafer surface which create extra pattern...
The different regimes encountered when submitting ultra-thin SOI structures implanted with arsenic to single pulse laser annealing with increasing energy density, are identified. It is found that nanosecond UV laser annealing can be successfully applied to rebuild a perfect monocrystalline SOI layer and reach arsenic activation levels at least as high as rapid thermal processing, with a reasonably...
In this paper, some key fundamental aspects of Metal / Insulator / Semiconductor contacts as well as practical issues occurring with their implementation are reviewed in order to fully comprehend the opportunities and limitations of this approach.
Advanced inductively coupled plasma techniques and surface treatments have been used to demonstrate 5nm conformal shallow junctions at low energy with no silicon structure damage. N-type PH3 plasma assisted doping was characterized by dopant diffusion and electrical activation with increasing wafer temperature. Plasma assisted doping at high wafer temperature showed no structure damage even at a high...
Backside nanotexturing fabricated by electroless metal assisted wet chemical etching, protected with a deposited thin silicon layer, is a new approach to create high bending strength silicon samples. Bending strength for protected nanotextured samples followed by CMP process was enhanced by ∼3.4 folds as compared to polished silicon samples, which emphasize the possibility of industrial implementation...
Following the recent trend of miniaturization of MEMS and the approach to improve the comfort of medical implants for patients by reducing their size the polymer Parylene is a promising candidate for encapsulation issues. Parylene combines a number of excellent properties like biocompatibility / biostability, chemical inertness, transparency and low water permeability. Within the presented work the...
This paper presents amino-terminated micro pattern transferring onto a mica substrate using polydimethylsiloxane (PDMS) soft stamp and proteoglycan (PG) molecular immobilization. PDMS bump-arrays with ultra-smooth surface were fabricated utilizing anisotropic etched silicon substrate as a mold. Coating and removal of releasing-agents were investigated to improve detachability of PDMS stamp from silicon...
Present advanced-process for the fabrication of through silicon via (TSV) with highly phosphorus-doped n++-polycrystalline Si plugs for driving an active-matrix nanocrystalline Si (nc-Si) electron emitter array was described. The resistance per one TSV was measured to be 150 Ω, and voltage drop at the TSV plug in a normal driving operation was sufficiently small to apply the diode current to the nc-Si...
Nanostructure has been envisioned as a novel factor to enhance biomolecular sensing characteristics. In this work, we propose a novel biosensor by using a nano gap formed between two electrodes for biomolecular detections. The nano-gap electrode increases sensitivity of near-surface electrochemical conductances. To examine the proposed sensing characteristics of the nano-gap electrode, different conductive...
We propose a simple yet effective method for the display based on vapor condensation on the hydrophilic/hydrophobic patterned surfaces. It was found that supersaturated water vapor first formed nanometer-sized water droplet on the condensation nuclei on the patterned surfaces, then the water droplet grew bigger and therefore scatter more light to visualize the outline of the patterns for naked eyes...
In this paper, we have proposed a spray coating method for electret material deposition. With this method, the thickness of electret can be well controlled and the surface potential of the charged electret can be improved comparing to the traditional spin coated polymer electrets. Furthermore, we have added some polystyrene nano particles into the electret, which can improve the surface charge stability...
In this sturdy, we investigated the bonding and debonding of the glass wafers using Surface Activated Bonding (SAB) method with the Si and Fe intermediate layers. In the fabrication process of the Thin Film Transistors (TFTs) on the ultra thin glass substrates for the display devices, the glass substrates are handled at high temperature and can be easily deformed. In order to achieve the accurate...
Room temperature bonding of Polymethylglutarimide was performed for a damage-free layer transfer method. The PMGI layer was bonded to support Si wafer by using the Surface activated bonding method using nano-adhesion layers. Using SAB, bonded area covering around 90% of the wafer surface, with a room temperature bond strength of ∼1 J/m2 is achieved. Micro voids at bond interface are never observed...
We reported the direct graphene transferring tech- nology to SiO2 substrate using self-assembly monolayer (SAM) last year. In this report, this graphene transferring technique was improved by applying other kinds of SAM with silane coupling treatment. In the former report, the SAM was deposited on the substrate after the application of precursor, however, the silane modified SAM was applied to the...
In this work, we mainly present our current development progress of high efficiency rear-emitter heterojunction solar cells using n-type silicon wafers, in three areas: a) silicon wafer surface texture treatment, b) a-Si:H(i) layer optimization for obtaining superior wafer surface passivation, and c) various TCO layer characterizations for improving the Jsc of the solar cells. We attained 20.78%,...
In 1968 I was hired by IBM as a staff chemist and worked for eight years at assigned topics like doped oxide diffusions, material stress, impurity gettering, and silicon wafer cleaning. For the next five years, I was part of the computer chip reliability group. There I learned about the dependence of silicon chip yields on the reduction of particulate and mobile ion contamination.
Reactive molecular dynamics simulations are used to simulate the chemical mechanical polishing process of silicon surface. The simulation process is carried out to investigate the interaction between SiO2 particle and Si surface in pure water. Both chemical and mechanical effects under different pressure between the silicon surface, water and a silica particle are clarified. This is the first application...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.