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The working principle and fabrication process of MEMS density sensor have been studied in this paper. And the density experiments were performed in acetone and silicon oil at temperatures in the range from 20.0 to 50.0 °C under atmospheric pressure. The maximum deviation and the average absolute deviation between the density experimental results and the reference values are −0.72% and 0.32%, respectively...
Micro Electro Mechanical System pressure sensors have been simulated with different structures for obtaining wider operation range with better sensitivity. The performance has been simulated and analyzed for silicon and SOI (Silicon-on-Insulator) pressure sensors. The performance of silicon and SOI pressure sensor at a given pressure and temperature are compared. Different diaphragms structures, were...
The electrical performance and energy yield of 25 PV modules were studied in the laboratory and under moderate climate conditions. The study compares thin-film technologies (a-Si, a-Si/μc-Si, a-Si/a-Si, CIS, CIGS and CdTe) and crystalline silicon technologies (mono- and polycrystalline). Intensive laboratory tests were performed before and after the outdoor exposure with regard to low irradiance behavior...
High energy yield has been and continues to be a major driver in PV installations. With the continuous improvement in PV modules' performance, there is a need to extract as much power as possible from the modules under various weather conditions. Over the past three years, we proposed, analyzed, built, installed, and monitored a PV system with string level MPPT dc/dc converters and a central inverter...
Unmixing in the reflective domain is a well known technique to retrieve materials and their abundances from hyperspectral imaging scene. However, for the thermal domain (8–14 μm) only few unmixing models were developed due to the complexity of retrieving three unknowns (i.e. materials abundance, temperature and emissivity) from the pixel radiance. Attempt to solve this complexity is using aggregation...
Light-emitting diodes (LEDs) are revolutionizing the illumination with energy savings and enhanced functionality. However, around 80% of the input power will be still transferred to heat. As the elevated temperature negatively affects the maximum light output, efficiency, quality, reliability and the lifetime of the SSL systems, thermal management is a key design aspect for LED products in terms of...
A combined fabrication process using polymer and silicon planar microtechnologies is presented here and used for the fabrication of a fully-integrated three-axis thermal accelerometer. The use of polymers (polystyrene and polyimide) with low thermal conductivities improves the overall power consumption of the thermal accelerometer and enables a simple and low-cost fabrication process. The accelerometer...
A robust, high precision sensor interface (SI) for in-situ temperature measurements in process engineering is presented. Wiring and interference are minimized by directly connecting thick film technology based sensing elements (SEs) to the interface PCB. Fully digital calibration, operating temperature compensation and noise canceling are demonstrated. A low-noise supply scheme for a wide range of...
A novel triaxial monolithic silicon accelerometer with improved temperature characteristics is presented in this paper. Two methods were put forward to improve the temperature characteristics of the accelerometer. One is the optimization of the anchor configuration to decrease the temperature drift, and the other is the integration of an on-chip matching capacitor to counteract capacitance variation...
A Si-Glass based MEMS piezoresistive pressure sensor is designed for harsh environment applications, such as vibration, shock and environment conditions with humidity, alkalescence or acidity, electrostatic particles and so on. The sensor chips were fabricated using SOI wafer-glass anodic bonding technology, which enables a single boron-implanted piezoresistor to be on lower surface of silicon diaphragm...
A new carbon-nanotube-based (CNTs) heat sink is developed. Due to their high thermal conductivity and aspect ratio, CNT boundles are used as fins of the heat sink. Fins as high as 300 µm with an aspect ratio of 30 are fabricated. For the thermal characterization of the heat sink, a microheater is integrated with the heat-sink and it is also used as temperature sensor. It is realized by using the low...
We present a CMOS-compatible temperature-independent tunable silicon lattice filter composed of 10 cascaded 2×2 asymmetric Mach-Zehnder interferometers. Experiments show the device has a wide wavelength tuning range and low temperature sensitivity of ~6.2 pm/°C.
An absolute pressure sensor based on liquid cantilever diaphragm is described in this paper. The diaphragm was fabricated by using liquid to bridge the gap between a piezo-resistive cantilever and the surrounding walls. Due to surface tension, the liquid filled the cantilever's gap while it did not leak through the gap. A cavity was designed under the diaphragm as a reference pressure. By choosing...
We demonstrate a temperature insensitive Si ring resonator by coupling the optical mode to a bi-material cantilever. We show the capability of athermal operation over 14 degrees, which can be further extended through proper optimization.
Silicon micro tuning forks are used as highly frequency selective sound detector for photoacoustic spectroscopy. The resonant properties and temperature dependencies of these sensors are investigated using the example of a fiber coupled methane sensor.
A high sensitivity temperature sensor based on a Sagnac interferometer consisting of a segment of selectively liquid-filled photonic crystal fiber (SLF-PCF) is proposed and demonstrated. The SLF-PCF is achieved by the high frequency CO2 laser and possesses unique birefringence feature. Numerical and experimental results are presented, and a high sensitivity temperature sensor with sensitivity of ∼−11...
This work provides for the first time an experimental assessment of the impact of thermo-mechanically induced stresses by copper through-silicon vias, TSVs, on fully depleted Bulk FinFET devices. Both n and p type FinFETs are significantly affected by TSV proximity, exhibiting lower impact on drive current with respect to the planar devices. The obtained results are in agreement with the thermo-mechanical...
In this paper we demonstrate that the steady state temperature increase due to the power dissipated by the circuit under test can be used as observable to test the gain of a 2GHz linear class A Power Amplifier. As a proof of concept, we use two strategies to monitor the temperature: a temperature sensor embedded within the same silicon die, which can be used for a BIST approach, and an Infra Red camera,...
This article represents the results of mathematical modeling of thermocompensation scheme using bipolar junction transistor. Also it represents the result of temperature testing by experimental model in extended temperature range 25–2500C. It was shown that practical realization of this thermocompensation scheme is real for temperature up to 2500C and this method is capable of minimization temperature...
Surface ionization (SI) is a form of gas detection which utilizes just as the well-established resistive response gas detection the interaction of adsorbed gas molecules and metal oxide or also noble metal surfaces. In contrast to the conventional resistive response detection the SI gas detection features a high amine gas selectivity. This work deals with the SI response mechanism and with the main...
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