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High speed TSV signals can penetrate through the dielectric liner material, transfer in the silicon substrate and degrade the performance of FEOL devices. In this paper we investigate TSV noise coupling to active device including both FinFET and planar transistors. Calibrated TCAD models are used to perform time domain analysis and understand the mechanisms of substrate noise interaction with active...
This paper presents new TSV-Based applications such as resonant inductive coupling, variable Inductor, power amplifier, bandpass filter, and antenna. These proposed systems use a spiral inductor built using TSV technology. The Resonant Inductive Coupling system increases the amount of magnetic flux linked between coils and improves the power transmission significantly. A proposed architecture based...
We illustrate a 2×2 quantum photonic switch fabric using two-photon quantum interference in an integrated silicon microring resonator array. Our modeling demonstrates phase- or wavelength-selective routing of single photons at different output states.
We report on the design and fabrication of a new type of microtoroid high-Q silica resonators monolithically coupled to on-chip silicon nanowire waveguides. In order to enable monolithic waveguide coupling, the microtoroid geometry is inverted such that the resonator is formed by thermal reflow at the circumference of a hole etched in a suspended SiO2 membrane. This configuration is shown to be conducive...
Light management in the Si bottom cell of a GaAs/Si tandem system is crucial due to the bandgap mismatch of the two materials, which results in a low current of the bottom cell. To evaluate the light coupling and light trapping, we developed an optical model to simulate the light absorption in the silicon bottom cell. This optical model is an extension of Basore's analytical model. By comparing the...
We numerically evaluate the device impact of photon re-absorption on InGaP/Si tandem solar cells using a coupled optical-electronic device model. The presented simulation results provide guidelines for designing high performance InGaP/Si tandem device. We find that including the effects of photon recycling (PR) and luminescent coupling (LC) results in a 12.5% increase in optimum top-cell thickness...
In order to provide basic considerations for the realization of methods for suppressing the mode-conversion and EM radiation from differential-paired lines with length mismatch, the mode-conversion in bend differential-paired lines with different EM coupling was studied with FDTD modelling. It is demonstrated that the differential-paired line with thinner dielectric substrate which can maintain narrow...
In this digest, we discuss a robust mechanism for electron spin relaxation in a broad range of materials, which have a substantial part of conduction electrons in different valleys that are not connected by time reversal (see Fig. 1 for examples). While the intervalley phonon scattering is important at relatively pure material and high temperature [1,2], we show that the intervalley scattering driven...
Skyrmions and chiral magnetic domain walls have attracted large interest recently. The underlying interaction of these chiral magnetic phenomena is the interfacial Dzyalosinskii-Moriya interaction (DMI). The interfacial DMI can be found in systems where a ferromagnet is in contact with a material with large spin-orbit coupling as for example Pt. Such systems enable novel memory and logic devices that...
With the increase of data rate, signal integrity (SI) becomes a bigger challenge for printed circuit board (PCB) designs. Power noise as well as signal loss, inter-symbol interference (ISI), crosstalk needs to be taken into account to ensure a good quality signal design. In this paper, a design case is shared where power noise greatly impacts SATA performance and leads to hard disk (HDD) disconnection...
With the advent of 2.5D and 3D IC, micro bumps has been highlighted as the core technology for realization of 2.5D and 3D IC. However, due to the difficulties about fabrication of reliable and cost-effective micro bumps, resulting in decrease in the final chip yield. In this paper, we propose a bump-less interconnection for high-speed signaling in 2.5D and 3D IC. In the proposed interconnection, high...
Tri-gate fin-FET processes are available, and likely to be the high-performance processes for the foreseeable future at process nodes of 22nm and below. We have investigated the major differences between design using bulk silicon devices and tri-gate processes. Differences do exist for the design engineering teams using the new processes, however, these differences are readily understood and there...
We present an ultra-compact metal reflector based grating coupler for coupling light between optical fiber and nano photonic waveguides. The coupler is designed and simulated based on Finite Difference Time Domain (FDTD) method. The lateral dimension of the grating waveguide has been tapered down from 10 µm to 400 nm within 8 µm length to interface with nano photonic waveguides using half overlay...
Asynchronous automata networks are commonly used to describe discrete-event systems consisting of several components. The components used here behave asynchronously since this is usually the case for a large class of automation systems. The asynchronous behavior is based on the ability of certain components to change their state regardless of other component's behavior in the network. This paper deals...
The characterization on coupling effect of on-chip octagon spiral inductors has been presented. The coupling effects in different parted distances are presented. And the relationship between the coupling and the distance is plotted and discussed. What's more, a practical design tip about the distance of adjacent inductors is presented. Finally, the predominant role of coupling effect is investigated...
This paper demonstrates the effect of nonlinear elasticity on the coupling between different bulk modes of silicon MEMS resonators. From experimental data, we observe that the coupling has a strong dependence on the resonant mode order, the mode shape of the coupled modes, as well as the doping type / concentration, and crystal orientation, leading to a variety of complex and potentially useful phenomena.
We demonstrate that graded-index (GI) profiles in square-core waveguides improve the loss at 45-degree mirrors on its ends over the SI-core waveguides. We also fabricate and characterize the mirror on GI “circular”-core waveguides.
A 3D integrated silicon photonic external cavity laser (SPECL) is presented. The laser comprises an indium phosphide reflective semiconductor optical amplifier with integrated turning mirror coupled to a silicon photonic chip through a grating coupler.
We report design and fabrication of photonic crystal (PC) Si membrane reflectors with integrated inplane couplers (Si MR-Coupler) based on Fano resonance effect. The measured results show the Si MR-Coupler has a 99% reflection and > 0.22% in-plane coupling efficiency.
We demonstrate how CMOS compatible photonic molecules (PM) can break the fundamental interdependence among quality factor (Q), channel spacing and size of microring resonators. Different PM architectures are presented for efficient and compact optical signal processing.
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