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The development of simulator system as a support to repairable spare parts management is reported. Through the use of this type of tool is possible to evaluate the behavior of a multiechelon — multitem spare parts inventory as a function of different stock levels, minimizing shortages and restricted to a given budget. The simulation constitutes a useful tool to evaluate different decision alternatives
We have performed non-equilibrium Green's function simulation of n-type ultra-small V-groove junctionless field-effect transistors (JL-FETs) on a silicon-on-insulator substrate under the ballistic condition. We find that the ON-current is determined mainly by the gap thickness and the subthreshold swing becomes the minimum at a gap-thickness of about 0.6 nm for the gate-length of 7.2 nm.
Toppling during clean process is a general structure issue when we scale down critical dimension (CD)/increase aspect ratio (AR) and density of the nano structures. In this paper, we demonstrated a novel process with CH4 PLAD (plasma doping) conformal process to eliminate the toppling issue. A uniform C deposition layer from CH4 PLAD process wrapped the whole structure on the top/bottom/sidewall and...
With the development of the integrated circuits, there is an inevitable trend in the development of the electronics industry, that the electronic devices become much smaller in shape, and integrated with higher density within, and more and more functionality. 3D SIP (System in Package) has become the mainstream technology for the microsystem integration. Meanwhile, the through silicon via (TSV) is...
A novel TSV structure, formed by two semi-cylinders combining with a quadrangular is proposed and analyzed in this paper. This novel structure can enhance the density of TSV array without significantly decreasing transmission performance and reducing impedance mismatch in TSV-RDL transmission line or depressing the signal crosstalk. Effects of design parameters, such as the side length of quadrangular...
TSV (through silicon via) is regarded as a key technology for 2.5D and 3D electronic packaging. And the manufacturing of the through silicon interposer is very challenge and costly. In the backside process of interposer, grinding is considered as the most promising technology to control wafer's surface roughness and surface defect. In this paper, according to the grinding process, a mathematical model...
Though Silicon Vias(TSVs) are regarded as a key technology to achieve three dimensional(3D) integrated circuit(IC) functionality. Annealing a silicon device with TSVs may cause high stress and cause TSV protrusion because of high Coefficient of Thermal Expansion(CTE) between silicon substrate and TSVs. The TSV wafers could be annealed right after copper plating process, or after chemical mechanical...
An approach to optimize the control parameters for an extended-kanban control system (EKCS) is studied. The EKCS is a Just-in-Time production system that involves the advantages of classical kanban and base-stock control systems. Although EKCS can be modeled as a discrete-time Markov chain, the state space is gigantic even for a single stage production system, making it impossible to numerically compute...
The development of 3D-silicon integrated circuits is an increasing demand especially regarding to advanced 3D-packages and high performance applications, with the intend to miniaturize and to reduce costs. Through-silicon-vias (TSV), interconnects and landing pads have a strong mismatch in proportions. Due to high temperature as well as high applied currents, the reliability of the systems and components...
We propose a new method for full-duplex self-interference cancellation. The proposed scheme uses a precoder to align the self-interference channel with orthogonal direction of detection axis. The simulation result shows that the proposed RP-SIC enhances the average throughput of user equipment compared to the conventional scheme in high residual self-interference region.
Coverage is an important metric used to measure the quality of service of three-dimensional wireless sensor networks (3D WSNs) monitoring a field of interest (FoI). While it is important to ensure the desired level of coverage, it is also necessary to do so with a minimum number of sensors from a network cost perspective. In this paper, we assume that the sensors are deployed at random uniformly in...
We consider the problem of estimating infection sources based on incomplete observations of the set of infected nodes at some point in time, assuming that the infection spreading process follows an Susceptible-Infected (SI) model. We derive an estimator that finds the source nodes associated with the most likely infection path that yields the incomplete observations. Moreover, we design a heuristic...
The aim of this paper concerns the design of a process control algorithm for a class of continuous large-scale systems where the measures and control functions are distributed on calculating members which can be shared with other applications and connected to digital network communications. At first, the nonlinear large-scale system is described by a Takagi-Sugeno fuzzy model (TS). After that, by...
Study the impact of the different parameters by simulation is the most important step in the way to practically fabricate an effective structure of any solar cell device. Therefore, an investigation of the thin film of Heterojunction with Intrinsic Thin layer (HIT) solar cells was conducted in different interface trap density profile which is the most influential feature. The doping levels and the...
After the first white light-emitting diodes (WLEDs) became commercially available, much attention has been paid to the development of WLEDs because of their extensive applications in solid lighting. Compared with traditional lighting, WLEDs have more advantages, such as high efficiency, long lifetime, fast response and environmental-friendliness [1-3]. It has been widely used in signals, displays...
A heterogeneous wireless sensor network (WSN) consists of sensors with unequal ranges of sensing and/or communication. In a dense WSN, a part of the region covered by a sensor may also be covered redundantly by a neighbouring sensor. In this paper, we analyse the redundancy in the coverage of a heterogeneous WSN and define the redundancy degree of a sensor. We follow a probabilistic approach to derive...
The determination of suitable process parameters for POCl3 diffusion, with the aim of minimizing emitter recombination and obtaining satisfactory contactability of the homogeneous emitter, is the aim of this study. It can be shown that different emitters with low Rsheet< 60 Ω/sq can result in significantly different emitter saturation current densities. Regarding the screen-printing metallization...
The paper examines the power dissipation patterns of different TSV interconnect configurations which could be employed in 3D IC. 1-TSV, 2-TSV, 3-TSV (straight line configuration, triangular configuration) and 6-TSV (rectangular configuration, hexagonal configuration) systems have been analyzed using the FEM based software Comsol Multiphysics (ver 4.2a). Co-axial variation of the TSV has been included...
Ultrathin PIN Detectors have been applied in radiation detection for particle identification and etc. In this paper, we present simulation research on the structure of ultrathin Si PIN detector based on bonding technology by using Sentaurus TCAD tool. The normal structure and reverse structure of ultrathin Si PIN detector are simulated and compared. The reverse current of detector and electrical field...
Due to the intermittent connectivity of content-centric opportunistic networks, data dissemination is often performed by replication which easily leads to network congestion. Many existing message forwarding or dropping strategies provide congestion avoidance based on only the node-related metrics or the message-related metrics, i.e. the meeting history between nodes, the number of subscribers, message...
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