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HALT, Highly Accelerated Life Test, is a process used to discover product weakness and design margins. Used on printed circuit board assemblies (PCBAs) or product modules, it consists of a series of environmental stresses applied to the product in increasing levels of stress, until the product malfunctions or fails. HALT typically utilizes stresses well beyond the product specifications in order to...
This paper presents a new method for testing materials at the microscale at high temperature under bending in-situ in SEM. The proposed method consists of a straining stage with built-in force and displacement sensors attached to a heating stage inside the SEM. The sample is co-fabricated with the stage to eliminate any misalignment error. The method is applied to test the strength of single crystal...
Load-sharing processes are commonly used to model systems with dependent components. The exponential distribution is widely used in load-sharing systems to model the component lifetimes because of its memoryless property. Testing the exponentiality in load-sharing systems is a challenging task due to the dependent components. In this article, we develop a conditional Monte Carlo test based on a sufficient...
To achieve the automotive quality for semiconductor devices represented by “zero defect”, “PAT” is actively applied to outgoing test. “PAT” has been generally used on wafer level test. This time we expanded it to package level test and established the method to detect the characteristic variations and to screen out the outliers.
Standard qualification methodology or “qual” does not specify product-level testing due to the diverse range of products and use conditions, a limited ability for system-level acceleration, and complication from system-level failures. This is a concern for emerging power-management technologies, since the fundamental switching transitions are not covered. We show that hard-switching with the well-known...
A very important aspect to fabricate MEMS devices, is understanding of the mechanical properties at micro-scale level. The mechanical properties of components not only depend upon the material but also on the micro-structure. Unlike other devices, MEMS components are developed from specialized micro fabrication processes in which they are subjected to cyclic loads thus producing intrinsic stresses...
Space electronic products usually should meet the mission requirements of long life and low cost. Because of insufficient failure data, it is hard to assess the reliability precisely by using traditional reliability testing and statistical method. In this paper, a method of reliability assessment based on integration of highly accelerated life testing (HALT) and accelerated degradation testing (ADT)...
Previous research focusing on the evaluation of transfer learning algorithms has predominantly used real-world datasets to measure an algorithm's performance. A test with a real-world dataset exposes an algorithm to a single instance of distribution difference between the training (source) and test (target) datasets. These previous works have not measured performance over a wide-range of source and...
The Integrated Fan Out (InFO) technology can accomplish package miniaturization and successfully achieve "More than Moore's Law." Its substrate-free technology also brings great cost-effective attraction for mobile and wearable applications. Ultra-thin integrated passive devices (IPDs) with high capacitance density can further shrink InFO size and boost bandwidth. Although the cost for the...
OpenDaylight (ODL), a popular controller for Software Defined Networks (SDNs), has a known problem of gradualdecrease in flow setup rate. After eight hours of continuous stresstesting, flow setup rate of the controller degrades by 80%. Weemploy a step by step investigation based on behavioral testingof emulated switches and controller. We suggested a fix for theproblem and modified version of ODL...
Recently authors have proposed damage equalization method with step-stress tests for quick estimation of life exponent of power equipment insulation. Traditional constant-stress accelerated ageing tests for insulation are disadvantageous since outliers in sample data will always be there and some samples may not fail even after a long time. Such long duration life estimation tests are a major bottleneck...
A new method of Highly Accelerated Stress Screen/Life Testing (HASS/HALT) for computer keyboards is introduced and compared with User Information Investigation (UII) from manufacturer, Accelerated Life Testing (ALT), and Normal Stress Reliability Testing (NSRT). The results of the above three lab testing processes all showed good accordance trends with the data from the UII. The failure mechanism...
This paper investigates detection of patterns in brain waves while induced with mental stress. Electroencephalogram (EEG) is the most commonly used brain signal acquisition method as it is simple, economical and portable. An automatic EEG based stress recognition system is designed and implemented in this study with two effective stressors to induce different levels of mental stress. The Stroop colour-word...
Accelerated degradation testing (ADT) is commonly used to obtain degradation data under the hasher than normal usage conditions, and to assess lifetime and reliability for high reliable and long life products in a short time. The optimal design for ADT is to propose the test plan based on the performance degradation process with a reasonable optimal criteria and the constraints of test resources....
Drop testing is very important in many industries. In industries, the items face severe environmental conditions during their working life. These environmental conditions can be due to high temperature, high pressure, vibration, transportation effect and it can be shock effects. Drop testing is used for shock effects. First of all, theoretical modeling was done for the drop table to check that either...
Hybrid steel-to-composite joints are being used more commonly for load bearing applications. However, these hybrid joints usually entail geometry and material discontinuities which can induce stiffness mismatch and cause local stress concentrations. The shock impedance mismatch caused by the different wave propagation characteristics can also be crucial to the structural response of the hybrid joints...
Aluminium is still one of the most important contact metallisations for power electronic chips like MOSFETs or IGBTs. With a large difference in thermal expansion coefficients (CTEs) between aluminium and silicon and the temperatures generated in hot-spots during high power transients, these layers are prone to failure due to thermo-mechanical fatigue. Usually lifetime assessment is done by subjecting...
ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical...
Die crack is a potentially serious issue affecting reliability and performance in Semiconductor industry. As a result, customers, particularly in the automotive industry, are concerned about the consequences of this failure mode and expect zero defect. In view of this an investigation was carried out with a focus to eliminate die crack occurrence in the AlInGaP die used in certain LED packages. Crack...
Insulation in electrical equipment is a very crucial aspect while designing any electrical system especially in case of high voltages in any part of a power system. Hence it is crucial to determine the properties and performance of an insulating material. The experiments deal with the measurement of breakdown voltages and determination of ageing of an insulating material under accelerated AC fields...
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