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To achieve the automotive quality for semiconductor devices represented by “zero-defect,” part average testing (PAT) is actively applied to outgoing test. PAT has been generally used on wafer level test. This time we expanded it to package level test and established the method of detecting the characteristic variations and screening out the outliers. Moreover, we suggest a way of thinking about the...
To achieve the automotive quality for semiconductor devices represented by “zero defect”, “PAT” is actively applied to outgoing test. “PAT” has been generally used on wafer level test. This time we expanded it to package level test and established the method to detect the characteristic variations and to screen out the outliers.
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