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Recent studies have suggested that endogenous electric fields can not only be considered as an observation window of neural activities but also form a feedback on membranes of adjacent cells which implies it may play an important role in network dynamic behaviors. However, the role of endogenous field feedback in the detectability of external weak signal is still unknown. In this study, we introduced...
In this paper the common-mode noise generation mechanism and its suppression is presented for the hard-switched isolated full-bridge forward topology. Due to the extensive interleaving of primary and secondary windings, such transformers exhibit large inter-winding capacitance which is the well-known cause of large common-mode noise current in the converter. Therefore, the effect of this large coupling...
The TSV-induced substrate noise has become an important issue in 3D-IC. When signals passes through TSV, noise will couple through silicon substrate and cause serious body voltage fluctuation. This paper proposes using carefully designed power distribution network (PDN) to reduce the coupling coefficient from TSV to surrounding devices. The impact of metal placement and its coverage percentage on...
Signal transmission in 3D integrated circuits (ICs) over through-silicon via (TSV) links inherently creates coupling interference on signal TSVs. This interference might be a crucial factor for the functional correctness of 3D ICs and therefore needs to be tackled. In this paper we propose a novel multi-TSV channel equalization method deployed in the digital domain, allowing almost perfect compensation...
In this paper, a substrate noise suppression method using P+ contact array and grid ground plane is proposed, which yield excellent noise suppression below −60 dB in extremely wide frequency range from DC up to 50 GHz. P+ contact array suppresses the low-frequency noise while the grid ground suppresses the high-frequency noise. Accurate circuit models are developed by simple extraction. The noise...
A 3D-integrated test vehicle that emulates noise generation and propagation in a heterogeneous integrated system has been developed. In-stack waveform capturers are embedded on each tier which captured the generation and propagation of noise. A consistent analytical model is created and analysis using that model has allowed us to develop a design strategy for the power delivery network to attenuate...
This paper presents an original concept of a 3D-PICS High density Integrated Passive Device Technology with P+ guard rings realized in a 300µm depth High Resistivity Silicon Substrate (HRS) in order to reduce significantly the substrate noise coupling. In this paper, a 3D-PICS IPD test chip was studied as the passive part prototype of a System-In-Package chip in combination with RF transceiver operating...
IPMSMs (Interior Permanent Magnet Synchronous Motors) are widely used for many industrial applications. However, IPMSMs cause large noise and vibration due to torque ripple and radial force. In this paper, 6th radial force caused by harmonic current is analyzed and modelling of 6th radial force is constructed based on flux linkage Based on this modelling, 6th radial force is mitigated by injecting...
A wide-tuning range QVCO with a novel complimentary-coupling scheme is presented. Two NMOS-only VCOs are coupled via complimentary PMOS injection transistors. This shifts the injection current away from the zero-crossings of the output voltage, thereby reducing the sensitivity of the VCO to injection noise, which results in significant phase-noise improvement. Phase-shift is achieved without frequency-dependent...
Underwater acoustic vector sensors (AVS) are devices which can measure scalar pressure and three dimensional acceleration or particle velocity with only one sensor. Direction of an acoustic target can be estimated by these four measured scalar values. Techniques based on either closed-form expressions or beamforming can be carried out for direction finding by using the axial projections of the gradient...
Due to large numbers of interferers, in-band interference is a bottleneck that future wireless heterogeneous networks have to deal with. Recent advances in information theory have shown that interference does not have to be avoided or strongly limited, so that reliable transmissions can occur. In this paper, we propose a novel Radio Resource Management (RRM) approach, capable to exploit those recent...
In this paper, a power reduction technique for wideband common gate low noise amplifiers (LNA) is proposed for low power application. Stacked current reused complementary capacitive cross coupling (CCCC) concept is proposed to improve LNA power efficiency. As a proof of the concept, the improved broadband differential common-gate LNAs (CG-LNA) designed in 0.18µm CMOS technology. The LNA achieves a...
With the technology nodes keep advancing, the application of TSV(Through Silicon Via) technology in 3D integration is faced with more challenges. The shift from via-last to via-middle fabrication scheme, the ever-increasing density of TSV, the reduction in supply voltage and the increase in frequency of on-chip local clock, all pose threat to signal/power integrity of the TSV system. In this paper,...
A potential technology by silicon interposer enables high bandwidth and low power application processing devices of the future, because the demand of smart mobile products are driving for higher logic-to-memory bandwidth (BW) over 30 GB/s with lower power consumption and ultra-memory capacity. This paper presents a 2.5D-IC structure with silicon interposer to demonstrate electrical performances including...
In this paper, a comparative investigation on power noise suppression between two blocks in printed circuit boards (PCBs) is presented. Eight noise isolation methods are discussed, including the reference case and seven most frequently used cases. Optimization and improvement for each method are discussed to achieve better performance. Through comparison, useful guidelines are drawn for real designs.
In this paper, an efficient noise isolation technique in mixed-signal systems using semi-lumped element resonators is presented. The resonators act as a filter which can be implemented between the power delivery networks of RF and digital circuits. The power filtering is accomplished due to a short circuit that can be induced between the ground and power planes of the RF domain at the designed resonant...
Assessing the I/O performance delta between dual-referencing and ground-referencing schemes is needed to enable a lower layer count on either board or package, thereby reducing the overall platform cost. Existing methodologies attempted in quantifying impact simultaneously on both PI (Power Integrity) and SI (Signal Integrity) [1], [2] although the work is usually focused on I/O power delivery impact...
In a server system, the switching voltage regulator (VR) noise coupled to the IO pins of the adjacent memory riser connector through the open air above the base board, and the link performance was impacted by the coupling. A simulation flow was developed to reproduce this EMI phenomenon. The flow first used electromagnetic field solvers to extract the VR related power network and the VR-IO coupling...
Noise caused by switching voltage regulator (VR noise) can have a big impact on system signal / power performance, leading to signal integrity (SI) / power integrity (PI) issues. This paper introduces systematic ways of reducing VR noise as well as VR noise analysis methods. And a real design case with VR noise issue is shared with simulation and measurement results.
Mobile computing devices such as Laptops, tablets, smartphones and the like mostly have GPS, WLAN, and cellular capabilities whose performance could be degraded in the presence of broadband noise in the receiver antennas vicinity due to integrated high speed buses and digital circuitry. Shielding, as a passive technique, has become a convention in the mobile wireless industry and we present here a...
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