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This paper deals with an overview of Silicon Carbide MOSFET-based power module failure modes and an experimental health-monitoring approach to detect them. The power module reliability question has recently emerged according to the development of converters in industrial fields such as: aerospace, automotive, traction… Nowadays, converters have a key role in the power transmission line. Besides, the...
In order to interconnect ultrafine pitch Cu-pillar/Sn-Ag micro bump, Non Conductive Films (NCFs) have been used. During thermo-compression bonding processes, applied pressure and heat make molten solder deform and wet on the sidewall of Cu-pillar. As a result, large Sn-Ag/Cu-pillar sidewall interface reaction makes Sn consumption faster and the Kirkendall void formation. In this study, novel double-layer...
This study focuses on the understanding of moisture diffusion physics under use conditions (UC) and its impact on definition of qualification requirements. It uses computational modeling and detailed measurements of UC to challenge some long held assumptions used in moisture risk assessments. It introduces the quantity called "Stable Wetness" to account for moisture amount present in the...
This paper presents the relations between processing, microstructure and mechanical reliability of copper pillar bumps (CuPi). Two sets of samples were manufactured: Cu/SnAg and Cu/Ni/SnAg with diameters between 15 and 20 µm. From the microstructure point of view: at these dimensions and for simulated reflows, up to 5, intermetallic compounds (IMC) follow a classical power law with a time exponent...
For the first time, an integrated thermal characterization scheme that generates a full two-dimensional temperature map of GaN lateral devices has been developed. Through calibration and integration of micro-Raman thermometry, thermoreflectance thermal imaging, and infrared thermography, the accuracy of these techniques has been demonstrated to significantly improve, in addition to the complete thermal...
Ultra fine-pitch interconnection technologies using non-conductive films (NCFs) have been actively developed in electronic packaging industry. However, NCFs that are based on polymer material has different material properties compared with silicon resulting in critical reliability issues. Particularly, reliability degradation from NCFs delamination and interconnection crack can take place due to coefficient...
Wafer Level Package (WLP) demand has been increasing in proportion to cost competitive device's demand year by year. In order to manufacture the WLP which has higher reliability efficiently, assembly processes with Bump Support Film (BSF) and Backside coating tape has been developed. The BSF consists of Back Grinding tape (BG tape) for getting a function as a wafer thinning and Bump Support Layer...
To take full advantage of silicon carbide (SiC) devices' superior electrical and thermal performance, advanced power module packaging designs and suitable materials are required. In this paper, the development of a new high power density module using the Power Overlay (POL) packaging platform is presented. The wirebond-less packaging platform has shown significantly reduced electrical parasitics,...
Fan-Out (FO) chip on substrate is one of the fan-out solution for package integration. This solution brings the short interconnection between die to die for excellent electrical performance. Fan-Out chip on substrate device provides excellent electrical performance in multi-die connection,. The multiple re-distribution layer (RDL) processing is implemented in advance multi-dies FO chip on substrate...
3D IC packages with stacked silicon interconnects (SSI) have many performance advantages over conventional flip chip packages. Using SSI, various die using the same or different technology can be connected to each other with the use of an interposer. The interposer allows a large number of die-to-die connections, enabling higher interconnect bandwidth, lower power consumption, and lower I/O latency...
A high reliability of light emitting diode (LED) light sources is essential for general and automotive lighting applications, where exchange of LED components is expensive. Thermal management of modern high power LEDs is crucial for their lifetime. An important aspect is the thermal path for heat conduction. Many different defects can have an influence on this path of an electronic system: on the...
The article considers the problem of improving the effectiveness and reliability of the adaptive control systems for the CNC machining centers due to the on-line diagnostics of machining process. The research results of the impact of the surface layer properties on the characteristics of the cutting process are given. The possibility of on-line diagnostics of the cutting process due to measurements...
The article deals with optimizing the structure of a radio-electronic system at its early stages of design on the basis of heterogeneous quality criteria and parameters determined by their alteration ranges. Drawing the complex vector of quality criteria allows to obtain the technique of multicriteria selection of the variant of a complex radio-electronic system on the basis of the set of possible...
The paper proposes a methodology for lifetime estimation of power devices at given applications operating conditions. The active cycling of power devices requires huge testing-time, because the process cannot be accelerated. For this reason, most often, the manufacturers provide information about the lifetime of power devices only for a few specific operating conditions. Most of the current methods...
The effect of the variation of processing parameters such as thermal history, or the composition of Sn-Ag-Cu solder joints, on microstructure and reliability performance depends strongly on joint geometry, in particular length scale. The advent of 2.5/3D packaging technologies in microelectronics has further decreased joint length scales and changed interconnect aspect ratios to reduce I/O pitch....
Lifetime reliability of electronics package is importantfor long term operation of microelectronic devices. Humidity, temperature and resulting strain are three mainreasons for the failure of a flip-chip semiconductor package. For these reasons, continuous research effort have been devotedto integrate moisture, temperature and strain sensorsin package performance and failure risk monitoring. Wehere...
In this paper, the intermetallic layer growth of the Innolot solder alloy (Sn/3.8Ag/0.7Cu/3Bi/1.5Sb/0.2Ni) has been investigated. A testboard was designed for 0603 size (1.5 × 0.75 mm) surface mounted resistors. The solder paste was deposited by stencil printing with a 100 μm thick, lasercut stencil. The components were soldered with vapour phase soldering. After the soldering, testboards were subjected...
Self-heating in AlGaN/GaN high electron mobility transistors (HEMT) degrades device performance and reliability. Under nominal operating conditions, a so-called hot spot develops near the drain-side edge of the gate. The magnitude of the peak temperature at this local hot spot directly impacts device lifetime. Especially, such self-heating effects are aggravated in AlGaN/GaN HEMTs employing low cost...
The role of electronic packaging is becoming more important and now constitute a much bigger percentage of the development of package with high evolution due to strong and competing demands for increased functionality and performance, further miniaturization, heightened reliability, and lower costs. Various types of packages like BGA and Quad Flat No-Lead (QFN) are widely used. Ball Grid Array package...
In article the experiments made with the measuring channel of temperature with automatic correction data conversion based on a method of sample signals are described. Analysis results of distribution laws and the value of the random component of the error are shown. The suggestions on application of multiple measurements for a decision on the introduction of a correction in the data conversion are...
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