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IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 5 > 882 - 891
2013 Winter Simulations Conference (WSC) > 1479 - 1490
2013 IEEE International Electron Devices Meeting > 31.5.1 - 31.5.4
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 5 > 882 - 891
2013 Winter Simulations Conference (WSC) > 1479 - 1490
2013 IEEE International Electron Devices Meeting > 31.5.1 - 31.5.4