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In this work, a lithography-free approach for fabricating patternable nanopillars is reported. The key technique of the approach is to introduce a gap over the substrate by covering it with a cap, which contains through holes and the material on its lower surface has similar etching rate with the substrate. By this means, uneven etching of the substrate is induced under the through holes, consequently,...
Because of the unique mechanical and electrical properties, silicon was widely used in IC/MEMS devices for decades. However, it is difficult to fabricate high aspect ratio structures when the feature size scaling down to 7nm. In this paper, single crystal Si nano barrel with wall thickness 6.7nm and aspect ratio 50∶1 was achieved by top-down process. The fabrication was carried out by Electron Beam...
This paper reports a new lithography method using thin-film edge electrodes (TEEs) to collectively transfer nanopatterns by generating oxide on the substrate surface via an electrochemical reaction (ECR). Nanometric thick TEEs are formed on the sidewall of insulating stamping structures. ECR-based oxide patterns have the same width and shape as the TEEs because ECR is induced only between the conductor...
For producing a variety of flexible MEMS sensors, we previously developed a process that uses a Cu On Polyimide (COP) substrate as a starting material and sacrificial Cu etching to produce a cavity and electrical feed-through structures on the substrate [1]. In the current study, we introduced a vacuum cavity realizing high thermal isolation in a flexible thermal sensor, for the first time. Parylene...
A new fabrication method for producing microchannel using metallic micromold is discussed in this paper. Microchannels have attracted different applications such as biochemistry, biomedical, lab-on-a chip and MEMS devices, etc. However, due to its lesser feature size the fabrication of it is a challenge set ahead. As microchannels have vast applications, but different feature size, finishing, materials,...
As designers of MEMS and bioMEMS strive for increased device performance and are exploring more exotic material systems, which may not be compatible with conventional photolithographic processes; techniques that can circumvent the limitations of conventional fabrication processes can offer new pathways for the creation of high impact devices. Microfluidic processes can provide precision control of...
Superhydrophobic surfaces show extraordinary water-repellent properties with low drag for fluid flow due to reduced liquid-solid contact area. Due to high contact angle and low contact angle hysteresis these surfaces also show self-cleaning effect. In nature different plants and leaves, such as Lotus leaf and Rose petals show superhydrophobic behaviour due to wax coated micro/nano hierarchical structures...
At small scale, the surface force becomes dominated, which causes difficult to the small object's manipulation. In this paper, we study the effect of the endeffector's contact area on the biological cell's manipulation. First, two endeffectors with different size are fabricated based on focused ion beam (FIB) etching. Then, they are used to detach the single cell from substrate. The maximum detaching...
This work presents a CMOS compatible method to develop suspended inductors. In other words, if analytical models for designing planar inductors do not take into account unwanted effects (due to the silicon substrate), our proposal is to etch the substrate in order to match both numerical results and experimental data. The accuracy in the inductance value is required not only to develop a design model,...
Catalyst-referred etching (CARE) is a noble planarization method which does not require abrasives. In this paper, we applied CARE with pure water to a 4H-SiC substrate in order to evaluate the removal rate and the surface roughness of the processed surface. The removal rate for the 4H-SiC(0001) on-axis wafer was found to be 2 nm/h while, in the AFM images, step-terrace structures were clearly observed...
In this work, we present an application of NCD layers as backside cooling for AlGaN/GaN heterostructures grown on Si substrates. In this case, diamond nucleation is the most limiting technological step due to low mechanical stability of GaN membranes. We observed that standard nucleation techniques (ultrasonic seeding or bias enhanced nucleation) caused cracking of the membranes or not appropriate...
To realize further high performance in semiconductor devices such as power devices in power electronics, the development of efficient processes and a reduction in the number of trial productions are indispensable. Therefore, the orientation of development plans and a reduction in trial production by using TCAD (Technology Computer Aided Design) are expected. Moreover, in relation to global environmental...
Silicon and organic materials are largely accepted as substrates for interposer. Glass outperforms the current interposer materials in a number of properties such as mechanical strength, low loss and chemical resistance. In addition it offers the potential of being a low cost but high density substrate material. As this is recognized glass is an emerging material for interposer application. While...
III–V compound semiconductor quantum dot (QD) optical devices, such as high-power lasers and high-speed modulators, have great potential for the future of telecommunications and quantum cryptographic communication. We developed a top-down method for fabricating InGaAs quantum nanodisks (NDs) arrays by using bio-template and neutral beam etching (NBE) processes. Damage-free InGaAs/GaAs nano-pillar...
With the miniaturization, multifunction, high speed development of the chip and package, the requirements for package substrate and 3D packaging becomes higher. As the IC line size continues to decrease, the signal transmission rate continues to improve and the amount and density of pin is getting more and more, the Pad pitch of package substrate which connects to it must be smaller and smaller. The...
We report preliminary tests on the realization of a semitransparent contact based on carbon nanotubes (CNTs) realized on glass substrate. Using a “double-zone” chemical vapor deposition technique (CVD) to synthesize CNTs directly on glass substrates, conductive and partially transparent contacts have been realized. Then, through a laser etching process it was obtained a partial patterning of the metal...
One of the technological challenges of direct observation of extra-solar planets remains to develop a modal filter operating from 6 to 20 μm. In the present paper we present one of the two candidate technologies for the fabrication of such modal filters, together with Fiber Optics: Integrated Optics. The solution based on alltelluride buried channel waveguides was considered. In the so-called waveguides,...
This paper reports a normally-off high voltage hybrid Al2O3/GaN gate-recessed MOSFET fabricated on silicon substrate. The normally off operation was implemented by digital gate recess using an oxidation and wet etching based AlGaN barrier remove technique. The Al2O3/GaN MOSFET features a true normally off operation with a threshold voltage of 2 V extracted by the linear extrapolation of the transfer...
Multifunctional and multistructured materials are currently developed for high power electronics in transportation and aerospace sectors requiring size and weight reduction. In this work, we investigate laser-machined micro patterns of CNT brushes as an alternative to metallic structures for driving simultaneously EM and heat propagation. The thermal response of the CNT array is observed to be sensitive...
Trench etching is an important process step for many semiconductor applications. Memory implementations, power devices and embedded capacitors benefit from lateral shrinkage of trench dimensions. But for physical reasons the depth of a trench that can be achieved for a given diameter is limited. We describe here a process with a sacrificial Silicon-Germanium (SiGe) layer on the sidewall of a trench,...
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