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VDMOS device (Vertical Double-diffused Metal Oxide Semiconductor) has the features of higher input impedance, lower drive current, higher switching speed, better frequency characteristic, bigger safety operating area and better thermal stability, which is used in many fields, such as switches in power electronic systems, so it has become the research focus of discrete power semiconductor devices....
For future DC electric power systems, high-power DC-DC converters will play a major role as they will substitute today's bulky 50/60Hz transformers. One key component within this DC-DC converters is the medium frequency transformer that provides the isolation level and the step up/down of the different voltage levels. As a consequence, an optimized design methodology that considers this high isolation...
This paper presents a cyber-physical (real-time sense-predict-adjust) thermal management for 3D multi-core system by micro-fluidic cooling. Auto Regressive (AR) model is used to predict future workload and the prediction is furnished by Kalman filtering to get rid of noises due to system variation. A thermal model is developed to sense thermal behaviour of the 3D system including micro-fluidic channels...
The trend for package size shrinkage has created challenges to thermal performance while improving the cost performance. When TO package size shrink by minimizing the leadframe copper usage, challenges in package warpage and thermal contact become great. TO High Creepage (a shrink version of new generation TO247) introduced difference copper thicknesses at die pad and heatsink for better material...
Thin form factor and high computing performance are the inevitable trend of notebook industry. Both vectors impose more stringent challenge on thermal solution design to maintain internal components and external chassis surfaces within temperature requirements. Cooling industry contributed great effort in miniaturizing conventional blower fan to thin form factor for supporting thin notebook cooling...
Package warpage or generally referred to as plastic package deformation has become more challenging with larger and thinner package body sizes. The detrimental effects of the package warpage are more prominent in peripheral packages with leads such as fine pitch LQFP (Low Profile Quad Flat Package). As all the leads are embedded in the plastic body, the warpage will displace the leads in the same...
This paper will act as a definitive guide on how the Junction to Case thermal resistance (RthJC) of an IGBT device is measured. This paper would provide an overview of the measurement circuit and the methods used in the measurement of an IGBT device housed in the T0247 package. We shall discuss the theory and formulas used to derive the thermal resistance of the device using the measured data. paper...
Accurate and efficient thermal analysis for a VLSI chip is crucial, both for sign-off reliability verification and for design-time circuit optimization. To determine an accurate temperature profile, it is important to simulate a die together with its thermal mounts: this requires solving Poisson's equation on a non-rectangular 3D domain. This paper presents a class of eigendecomposition-based fast...
While effective thermal management for 3D-ICs is becoming increasingly challenging due to the ever increasing power density and chip design complexity, traditional heat sinks are expected to quickly reach their limits for meeting the cooling needs of 3D-ICs. Alternatively, integrated liquid-cooled microchannel heat sink becomes one of the most effective solutions. For the first time, we present fast...
Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the barriers in interconnect scaling, offering an opportunity to continue the CMOS performance trends for the next decade. However, from a thermal perspective, vertical integration of high-performance ICs in the form of 3D stacks is highly demanding since the effective areal heat dissipation increases with...
Electroplated copper films used for thermal management introduce strain to red VCSEL mesas, changing laser DC characteristics. Larger plated area generally causes larger strains as determined by gain offset measurements and can double threshold current.
A single chip design of class D audio power amplifier is presented. It is composed with a rail-to-rail operational amplifier and a closed-loop pulse width modulation. It achieves a maxim power of 3.75W and consumes about 1.9mA quiescent current as maxim efficiency is more than 90%. When sine wave input signal frequency is 1KHz and output power is 3.75W, the THD of output signal is only 0.1%. The chip...
In the early stage of processor design, Dynamic Thermal Management (DTM) schemes should be evaluated to avoid excessively high temperature, while minimizing performance overhead as small as possible. In this paper, we show that conventional thermal simulations using fixed ambient temperature may lead to wrong conclusion in terms of performance and temperature; though ambient temperature converges...
IC power consumption is not only a thermal management challenge but also responsible for a few percent of world electricity usage while expected to grow fast. Reducing power usage is basically about reducing fCVDD2. SOI may play a significant role.
The miniaturization and increasing complex integration of functional chips handheld devices such as cellular phones have led to the widespread adoption of chip scale packages (CSPs) and ball grid array (BGA) packages. Lighter weight, thinner thickness, smaller size, high I/O pins, low cost, high functions, high quality and green environmental material are trend of IC packages and continuously challenge...
For the feature of "slim and light" in portable devices, stacked 3D-IC architecture was introduced in the advanced packaging techniques. The traditional FR-4 substrate was substituted by Si substrates. In general, the thickness of Si chip and substrates would be larger than 300 micron. However, silicon is rigid and has high resistance of deformation. Therefore, the thermal stress caused...
In this paper we present the thermal analysis and reliability performance of high power light-emitting diodes (LEDs) with silicon carrier packages. The junction temperature of LEDs is an essential reliability parameter. Exceeding the maximum raised junction temperature could lead to light output degradation and sometimes even to destructive failure. Therefore thermal management and proper thermal...
In this work, IMC (Inter metallic compound) of lead free (Sn-Ag-Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on the four kinds of surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) were investigated by Focus Ion Beam microscope (FIB). Sample after failure ageing conditions (Baking...
Along with the increase in circuit density, it becomes more difficult to dissipate heat through the surface of the components. Therefore, the designs and applications for the materials used in heat dissipation as well as high thermal conductivity and low CTE have become the focal point for discussion. In addition, as the high luminance of LEDs is increased and development for brighter LEDs continues,...
The developing trend for the high performance electronic devices still focuses on light, thin, short and small exhibiting high heat resistance and multi-functional properties, To meet the above requirements, the copper clad laminate substrate preferably produced from the materials having high thermal resistance, high glass transition temperature and low CTE. For the above purposes, we developed a...
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