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Transient thermoreflectance imaging method has been applied for the first time to reveal current distribution in ESD protection devices through the surface temperature change due to self heating. Experimentally calibrated temperature images are obtained of a multiple finger, 80 square micron 100V NLDMOS-SCR device in snapback operation regimes for different current levels (1.15-1.47A) and at different...
While 3D stacked multi-processor technology offers the potential for significant computing advantages, these architectures also face with the significant challenge of small, localized hotspots with very large power dissipation due to the placement of asymmetric cores, heterogeneous devices and performance driven layouts. In this paper, a new thermal management solution is proposed that seeks to maximize...
Aiming at the aircraft fuel system which adopts the technology of vapor cycle cooling system, and uses the fuel as a kind of effective cold source of condensers and other heat exchangers, this paper established the mathematical models of the fuel system and major components. On the basis of Simulink software platform, the simulation module of fuel system was established by developing the S-functions...
In this paper, we develop a methodology to obtain medium-order electrical equivalent circuits (ECs) of the thermal behavior of 2D systems with radiation. The method combines several elements: (a) The use of detailed finite-element (FE) simulations of steady-state thermal behavior; (b) graph theoretic partitioning of FE meshes to decompose the geometry at intermediate levels of detail; and (c) physically-guided...
Increased miniaturization, higher power densities, and demands on system performance and reliability in electronic systems have necessitated more aggressive heat removal techniques in the thermal management of electronic components. Air jet impingement, especially in conjunction with surface enhancement, is an attractive option since a heat removal compacity similar to liquid cooling may be achieved...
As process technology continues to shrink, interconnect current densities continue to increase, making it ever more difficult to meet chip reliability targets. For microprocessors in the latest 32nm processes, interconnect wear-out via electromigration is as critical a design parameter, if not more so, as timing, power, and area, and must be planned for from the outset. This paper presents a true...
Dynamic thermal management (DTM) schemes rely on physical sensors to provide them with feedback to ensure an accurate and closed-loop throttling mechanism. Power-density trends in current-generation, high-performance processors motivate the need for multiple low-area, low-power and high-sensitivity temperature monitoring circuits. To this end, we have proposed and implemented in 45nm CMOS, a novel,...
Thermal resistance data were collected using two different style flip chip ball grid array (FCBGA) packages; one with an exposed molded die and a second with a lid. Eleven different heat sink designs and two different thermal interface materials (TIM) were tested to quantify the thermal interaction between heat sink size, base material and TIM resistance as a function of package style. Package style...
In many communications applications semiconductor devices operate in a pulsed mode, where rapid temperature transients are continuously experienced within the die. We proposed a novel junction-level cooling technology where a metallic phase change material (PCM) was embedded in close proximity to the active transistor channels without interfering with the device's electrical response. Here we present...
Surface temperatures of electronic equipment and other machinery are an important design constraint since excessively high temperatures can be a safety hazard. Thus, government and industry standards have been established for maximum acceptable temperatures of hot surfaces that may be touched. Unfortunately, their recommendations are often limited to a few broad classes of materials, and appear to...
The following topics are dealt with: semiconductor thermal measurement; multidisciplinary thermal management; liquid cooling systems; thermal tools and calculators; embedded tutorial; data center; packaging advances; heat transfer fundamentals; microelectronics thermal characterization; heat sink geometries; high power density cooling; thermal process and design; materials science.
In this work, thermo-mechanical stability of silver diamond composite materials, with thermal conductivities as high as 830 W/mK, was studied. These novel materials have great potential for applications in thermal management and electronic packaging industry. As demonstrated in our previous work, an improvement of 50% in terms of thermal management can be obtained with silver diamond composite with...
This paper presents the design and the practical realization of a measurement stand dedicated to thermal characterization of electronic packages. The standard Dual Cold Plate (DCP) solution is enhanced with the Peltier Thermo-Electric Modules (TEMs) and a tensometer bridge. The TEMs are automatically controlled by a special circuit so as to provide either constant case temperature or constant thermal...
MOSFETs in an RF amplifier dissipate high heat flux due to switching and conduction loss. MOSFET's junction temperature affects product reliability adversely. This paper presents a thermal management method used in an RF amplifier development with junction to case temperature rise transient analysis, Thermal Interface Material (TIM) testing, clamping structural Finite Element Analysis (FEA), and Computational...
A novel thermal management technology was explored to lower the peak temperature associated with high power GaN transistors in pulse application. The technology involves the use of an embedded microscale PCM heat storage device within the chip (near the active channels of the GaN device), which effectively increases the heat capacity of the material by taking advantage of the latent heat of the PCM...
Future thermal management of microelectronics demands high heat flux removal capabilities due to rapid increases in component and heat flux densities generated from integrated circuits (ICs). Although electrospray evaporative cooling (ESEC) has been investigated as the potential package-level thermal management solution for future microelectronics, the optimal heat transfer performance of ESEC devices...
The thermal management of semiconductor devices and systems has become a widely discussed topic over the past decades due to the ever increasing integration and the resulting power densities inside the packages. The increasing junction temperature is a great threat for the operation and the long-term reliability of the packaged device. One of the most important barriers in the heat conduction path...
We developed innovative solutions for reaching high performance in carbon-nanotube-filled engineering materials. Electrospinning was applied to improve the thermal conductivity in polymer composites via the alignment of nanotubes in a polymer matrix. Alignment was achieved by flow-confinement and charge-induced alignment during electrospinning. Additionally, the use of liquid crystal polymer as a...
This paper discusses the use of the second law in heat sink design. A new entropy-based cost function is proposed and compared with existing heat sink cost functions. A case study of a plate fin heat sink points out that this newly developed cost function offers a heat sink which is more than twice as efficient as a heat sink designed with the traditional thermal resistance minimization objective...
Thermal management of Integration Circuit (IC) becomes more and more important with the scaling of CMOS technology and dramatic increase of power density. Performance of thermal management application is highly related to the accuracy of the temperature monitoring devices. However, due to increasing process variations and parameter drifts, temperature measurements by on-chip thermal sensors may not...
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