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The thermal cycling performance of lead free soldered ball grid arrays (BGAs) and chip size packages (CSPs) soldered with eutectic SnPb solder paste, so-called backward compatible assemblies, tends to drop with increasing Pb concentration in the joints. This is a particular concern for fine pitch CSPs where concentrations are invariably rather large. Flip chip assembly life is almost always improved...
Thermal fatigue of solder joints is critical to electronic package performance and life consideration. Failure caused by device warpage (WPG) problems is a major challenge with demands for miniaturization and system integration in a faster, better, and cheaper environment. This paper discusses a relationship between warpage and thermal fatigue life time and failure mechanism under thermal cycling...
Amkor's FCMBGA, flip chip package based on transfer molding for high performance device was developed and introduced to industry in 2008[1,2]. During the molding process, bump deformation was not significant, and voids were not observed under flip chip die. Coplanarity with a low coefficient of thermal expansion, CCTETE, substrate construction was similar to a single piece lidded package construction...
In this paper a possible method demonstrated for in-situ reliability testing of various TIM materials. The method is based on thermal transient measurements of a power semiconductor device in a TO-type package which has a flat, external cooling surface. By powering the junction of the semiconductor cyclically the whole assembly is exposed to intense thermal cycles in which the main heat-flow path...
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