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A low-volatile organic compound, screen-printable silver ink system capable of also performing as a conductive adhesive was developed for use in advanced microelectronics. Silver flake and micron-sized spherical silver powder were used as the conductive fillers with the binder system consisting of monofunctional liquid acrylate monomers. Because of the thermoplastic nature of the cured binder system,...
The electrical and thermomechanical properties of isotropic conductive adhesive materials vary significantly during the material cure process as polymer crosslinking alters the molecular structure and volume of the material which, in turn, alters the percolation threshold causing step changes in the values of electrical and thermal conductivity within the material. It is therefore important to ensure...
With fast development of electronic packaging, the conductive adhesives were widely used in surface mount and chip interconnection. As an alternative to solder, it has many advantages, such as low processing temperature, less environment contamination and fine pitch capability. However, conductive adhesive joining technology also simultaneously faces a lot of challenges. The major problem of current...
With the rapid developments of electronic packaging, there is an increasing demand on high performance isotropic conductive adhesives (ICAs). However, the traditional ICAs are brittle, sensitive for crack formation and delamination, which is one of the major drawbacks that limits their use in a wide range of applications. Therefore great efforts have been made to make conductive adhesives more flexible...
The need for flexible interconnects in advanced applications in consumer electronic products is increasing rapidly. The reliability and flexibility of ultra-thin chip-on-flex (UTCOF) interconnects formed using anisotropic conductive adhesive (ACA) are thus investigated. Two films of ACA materials, namely ACA-P and ACA-F, are assembled at different bonding temperatures to study the effect of temperature...
A novel flexible electrically conductive adhesive (FECA) has been designed for electronic interconnect applications that require high flexibility on the flexible substrates and connectors. The physical properties of the resulting ECAs such as the elastic modulus, glass transition temperatures, adhesion strength and electrical properties were characterized by differential scanning calorimetry (DSC),...
In this paper, a novel isotropic conductive adhesive containing different fillers, which shows better properties at high temperature compared with traditional ones, was developed and the properties of various fillers were investigated. Silver flakes as the main filler and secondary materials such as silver nanoparticles, carbon nanotubes (CNT) with different volume ratios are combined to form bi-modal...
For the future advanced applications in consumer electronic products, the need of flexible interconnects increases rapidly. The reliability study of ultra-thin chip-on-flex (UTCOF) interconnects using anisotropic conductive adhesive (ACA) is thus reported herein. When the flexible device is bent, since the interface between ultra-thin chip (<50 mum in thickness) and substrate may create the major...
In this paper, a novel flexible electrically conductive adhesive (FECA) has been designed for electronic interconnect applications that require high flexibility at the interconnects, such as assembly and repair of flexible circuits on flexible substrates and connectors. The physical properties of the resulting FECAs such as the elastic moduli, glass transition temperatures, adhesion strength and electrical...
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