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Interfacial delamination in encapsulated silicon devices has been a great reliability concern in IC packaging. Experimental testing of a transparent quad flat no leads package is carried out with the goal of studying the delamination characteristics and investigating the viability of cohesive zone modeling in simulating delamination patterns and trends. The pattern of initiation and propagation of...
Interfacial delamination in encapsulated silicon devices has been a great reliability concern in IC packaging. Experimental testing of a transparent Quad Flat No Leads Package (QFN) was carried out with the goal of studying delamination characteristics and investigating the viability of cohesive zone modeling (CZM) in simulating delamination patterns and trends. To simplify the study, the package...
As a consequence of increasing functional density and miniaturization in microelectronics new low-k and ultra-low-k materials are going to be increasingly used in Back-end of line (BEoL) layers of advanced CMOS technologies. These ongoing trends cause novel challenges for reliability analysis and prediction of relevant electronics assemblies. The optimization of fracture and fatigue resistance of...
Interfacial delamination is known as one of the root causes of failure in microelectronic industry. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage. In order to be able to judge the risk for interface fracture, the critical fracture properties of the interfaces being applied should...
Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package...
Interfacial delamination has become one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in mechanical properties of the materials adjacent to the interface and also possible...
Interfacial delamination has become one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in mechanical properties of the materials adjacent to the interface and also possible...
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