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The nonlinear response of silver nanoparticles filled epoxy resin composites under increasing applied voltage is investigated. The influence factors of applied high voltage on the conductivity of composites are measured by the collection of the electric current passing through the sample. With the increase of applied voltage, the composite has a nonlinear conductive characteristic. The contributing...
Silver-based conductive ink is the key material in printed electronic technology. With the development direction of the electronic products to the miniaturization, flexibility direction, the traditional micron-grade metallic silver conductive ink has been unable to meet the requirements of low sintering temperature and printing precision. In this case, nano-silver ink should be developed. In this...
Silver nanoparticles stabilized by sodium citrate with an average size of 10 nm were obtained via a modified Carey-Lea method. The synthesized silver nanoparticles were investigated by transmission electron microscope and powder X-ray diffraction. Thermal decomposition and exfoliation of the capping agent from the surface of the nanoparticles were studied by thermogravimetric and differential scanning...
In this work, we present a novel piezoresistive tactile sensing array which is capable of retaining and erasing tactile images. The sensing element comprises polydimethylsiloxane (PDMS) polymer mixed with multi-wall carbon nanotubes (MWCNTs) and silver nano-particles by using the dielectrophoresis (DEP) technique. When the sensing element is pressed, the resistivity increases and retains. The resistivity...
Printed electronics have become research focus due to their distinct characteristics such as tiny, flexible, thin, and easy to carry. Printed electronics have shown great potential in daily use, such as RFID tags, smart cards and displays. Silver nanoparticles have been applied as conductors in printed electronics. Different kinds of chemicals are used as solvent and stabilizers to prepare nano silver...
This paper realizes the low-cost mm-Wave antennas using inkjet printing of silver nano-particles. It is widely spread that fabrication of mm-Wave antennas and microwave circuits using the typical (deposit/pattern/etch) scheme is a challenging and costly process, due to the strict limitations on permissible tolerances. Such fabrication technique becomes even more challenging when dealing with flexible...
In this study, we reported the development of a novel highly electrically conductive adhesive (ECA) that can be used in ink-jet printing and have the function of adhesive by a single step of low temperature sintering/curing. With the introduction of silver nanoparticles into the formulation, the electrical resistivity of the resulting ECAs is about 10-5 ohm-cm after sintering at 180degC or using a...
In this paper, a novel isotropic conductive adhesive containing different fillers, which shows better properties at high temperature compared with traditional ones, was developed and the properties of various fillers were investigated. Silver flakes as the main filler and secondary materials such as silver nanoparticles, carbon nanotubes (CNT) with different volume ratios are combined to form bi-modal...
The goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity to edge these properties toward to properties of solders. The electrical resistance and nonlinearity of I-V characteristic have been investigated. Two ways have been used for electrically conductive adhesive modification: addition...
Silver migration has long been one of the most critical issues in semiconductor electronic industry, while no effective approaches have been developed to control silver migration and maintain its excellent electrical and thermal properties. In this paper, we report a novel approach of using molecular self-assembled monolayers (SAMs) to dramatically reduce silver migration in the nano-Ag conductive...
Electrical properties of the isotropic conductive adhesives filled with micron sized silver flakes and nanosized silver particles were investigated. By using appropriate surfactants, the resistivity of the silver flakes and silver nanoparticles incorporated conductive adhesives was dramatically reduced to as low as 5 times 10-6 Omega.cm. Morphology studies showed that the decreased resistivity resulted...
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