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We have demonstrated packaging of a silicon photonic chip with polymer multimode waveguides on a package substrate in a face-up electro-optic 3D integration scheme. The optical loss at the die-to-package interface in O-band was measured to be 7.6dB, which agrees well with simulation.
A fabrication process is demonstrated to form curved image sensors based on CMOS image sensor technology. A stretchable polymer backplane is fabricated monolithically on the backside of the wafer before a DRIE etch is performed to segment the wafer and make the circuit stretchable.
We report the results of investigations of thin films of the composite based on the semiconducting polymer polyfluorene and graphene oxide particles with different content of the graphene oxide by terahertz time-domain spectroscopy.
3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. The polymer material as insulation material was fabricated by the spin-coating or spray-coating process. And the polymer insulation can relax some of the stress induced and makes the process more convenient compared with CVD. Therefore, it is the most cost effective technology for the wafer level...
Hybrid integration of GaN and Si photonic devices is promising. Using a polymer bonding technique, GaN microring resonators are fabricated on Si substrate. Transmission characteristics of the GaN microring is measured.
In this paper, we demonstrate that low insertion loss is achieved in channel-shuffling polymer waveguide having graded-index (GI) square cores (24 channels × 24 channels) with a 125-mm interchannel pitch. Although there are several fabrication methods for GI-core polymer optical waveguides proposed, the index profiles formed in the square cores are not ideally symmetric, when conventional photo-lithography...
The interest in wearable electronics has been rapidly increasing due to the high demands for various wearable devices such as smart glasses and smart watches which satisfy the needs of today's customers. Future wearable devices will require fully flexible chip packaging performance and also maintain stable electrical performance under repeatedly bending environment. To meet these requirements, ultra-thin...
High-throughput assembly of miniature wafer-fabricated packages onto panel substrates provides a manufacturing framework for high-performance multi-functional displays and other large-format systems. Control circuits, light emitters, sensors, and other micro-components formed in high-density arrays on wafers use a variety of processes and materials that do not easily translate to large-format panel...
In this paper we present a new approach for building specific packaging that is scalable, versatile and could be potentially cost competitive. Using polymer additive manufacturing, more commonly known as 3D printing, we set out to build customized structures and packages perfectly adapted to component dimensions and specifications. Two different 3D printing technologies, respectively called stereolithography...
In this paper, finite element method (FEM) simulations are carried out with pillar-concave structure using silicon substrate, silicon substrate with polyimide (PI) and with polybenzoxazole (PBO) for realization of Cu-Cu bonding at low temperature. Parameters of bonding temperature, pillar diameter, concave sidewall angle, and multilayer of concave structure are all considered in simulation. In addition,...
Reliability analysis is performed for various redistribution layer (RDL) interconnect patterns. Five different RDL patterns are designed to examine die pitch, line length, line width, dummy block, and die edge/corner effects on RDL reliability. Temperature dependent material properties, grain growth induced stress, thermal mismatch stress, and plastic deformation evolution are taken into consideration...
Quartz due to its piezoelectricity and its good temperature stability is one of the most used materials in devices for time-frequency applications. Quartz resonators are generally obtained by chemical etching or chemical mechanical polishing but these two methods do not allow the shrinking of the dimensions of the devices and limit reachable geometry: in particular structures with high aspect ratios...
Through-Si-via (TSV) with polymer liner formation has attracted considerable attention because a polymer liner can be formed easily by spin coating, and it has low dielectric constant and good coverage along the TSV surface. A polyimide (PI) was used as the polymer liner of TSV. However, there is a high charge-trap density in the PI layer. These charge traps leads to modulation of the parasitic capacitance...
Increasing data needs much larger memory capacity. One of the Flash Memory Solution is Vertical NAND (V-NAND) Flash Memory. In order to fabricate this device, a high aspect ratio hole must be made in the channel hole through the etching process after multilayer thin film deposition. In order to obtain high aspect ratio etch, process condition should have high RF power, high flow rate of polymer gas,...
Polymer film is general used for stress buffer and dielectric film for Wafer Level Chip Scale Package (WLCSP). Chemical resistance and mechanical resistance of polymer films usually get worse after several processes with chemicals or heat. Weak chemical or mechanical resistance will induce polymer film cracking. Polymer cracking further induces humidity penetration into RDL (Re-distribution Layer)...
Deep Reactive Ion Etching (DRIE) has revolutionized a wide variety of advanced package applications. Cavity etch process is an important step for fan-out wafer level package (WLP), which general fabrication by DRIE. In this paper, we investigated the influence of process parameter on the profile and etch rate in square-hole cavity etch. Sidewall angle was controlled by fluorine isotropic etch. So...
We present a fabrication method for thin-film polymer MEMS that achieves an order of magnitude improvement in feature size and resolution. Specifically, we modified the electron beam lithography (EBL) process for biocompatible poly(chloro-para-xylylene) (Parylene C), enabling flexible, encapsulated titanium structures with features as small as 100 nm. The mechanical, electrical and material properties...
This work presents a novel electrothermal oscillator driven by a fixed DC voltage, and its application in thermopneumatic diffuser pump. The proposed device employs ultra-sensitive temperature sensing material which was made by dispersing acrylate copolymer with graphite particles. The fabricated device features advantages such as simple fabrication process, easy operating method, and simple system...
Recently, hydrogel nano-probes have been proven to be exclusively useful for high-speed and less damage atomic force microscope (AFM) imaging on soft or biological matters. However, from the classical tribology standpoint of view, soft and compliant natures of hydrogel nano-probes seem incompatible with long-term reliable imaging. Here, we report counter-intuitive results showing the hydrogel AFM...
For the realization of the IoT (Internet of Things) society where the arrival is strongly predicted soon, the construction of an intelligent sensor network is important. For such a sensor network construction, the enormous numerical fusion devices that CMOS devices and MEMS sensors are integrated are essential. To develop WLCSP (Wafer Level Chip Size Packaging) technologies as high density packaging...
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