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Spray cooling has remained one of the highest heat flux removal schemes across various applications such as cooling power electronics, lasers, high power LEDs, servers, supercomputers etc. Researchers have been researching extensively to obtain the maximum heat transfer coefficient. The effects of different parameters of the spray cooling system have been studied in the past. The focus of the present...
Thermal resistance of an electronic package is a measure of the package's ability to transfer the heat generated by the chip to the printed wiring board (PWB) or to the ambient. For a high performance flip-chip package, the primary heat transfer path for most applications is through a heat sink or cold plate attached to the package lid. Hence, a test method that evaluates the heat transfer path from...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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