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Bioencapsulation is a low-cost, low energy demand technology for harnessing the power of microorganisms for applications such as bioremediation, biosensing, and biocatalysis. Silica gels have been investigated for bioencapsulation, yet few studies have focused on gel mechanical properties and biocatalytic activity simultaneously, instead studying the viability of the encapsulated microorganisms. In...
Polyimides (PI) are widely used in microelectronic industries because of their outstanding characteristics such as good mechanical, thermal and dielectric properties. In this paper, a novel PI/SiO2-Al2O3 co-doped composite film was prepared. The inorganic phases of SiO2 were added to PAA solution by sol-gel method with TEOS as precursor, while the Al2O3 phase was added as particles by ultrasonic-mechanical...
Nanocomposite materials show promising results for applications as electrical insulation. Among several materials presently under investigation, previous works indicate that polypropylene and ethylene-vinilacetate filled by nanosilicates present lower content of space charge and higher electric strength. However, efforts are needed to explain nanocomposite behaviour and characterize their electrical,...
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