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IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 4 > 708 - 712
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 10 > 2856 - 2866
IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 5 > 1558 - 1564
IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 4-2 > 1329 - 1338
IEEE Transactions on Nanotechnology > 2017 > 16 > 4 > 695 - 702
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 6 > 925 - 935
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 6 > 936 - 943
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 5 > 1601 - 1610
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 5 > 1703 - 1713
IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 2-1 > 461 - 467
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 4 > 502 - 510
IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 1 > 207 - 216
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 1 > 138 - 152
IEEE Transactions on Circuits and Systems II: Express Briefs > 2017 > 64 > 1 > 11 - 15
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 7 > 1009 - 1019
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2510 - 2516
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2503 - 2509
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2016 > 24 > 5 > 1636 - 1648
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 5 > 775 - 783
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 5 > 703 - 711