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This paper introduces a novel design of high current field emitters based on unique pin structures with a ball shaped tip. Our ball-tip pins provide relatively large surface area at the tip and increase the field enhancement factor regardless of dimension of the pin base. The ball-tip pins turn out to produce higher field emission current than that from the generic sharp-tip pins due to the significantly...
Solar cells consisting of extremely uniform and ordered large-area arrays of silicon micropillars are fabricated using metal-assisted chemical etching. Micropillar diameter, pitch, height, and core-shell doping profiles are optimized for light trapping and carrier collection.
This work details the fabrication processes for a broadband antenna on a MEMS steerable platform. The platform is capable of rotation around two independent axes through the use of four silicon torsion hinges. The device is fabricated using traditional bulk micromachining techniques. Silicon is used as the substrate material due to its well understood processing characteristics. The antenna is modified...
This paper presents a Si-CMOS-MEMS fabrication process which leaves the back-side silicon under the CMOS metal and oxide layers, and improves the uniformity of the back-side silicon using back-side grinding. The Si-CMOS-MEMS process includes a grinding process followed by a bonding process and conventional post-CMOS etch. A Si-CMOS-MEMS accelerometer is used to demonstrate the feasibility of the Si-CMOS-MEMS...
This paper demonstrates a dry heterogeneous integration process for embedding CMOS chips into a partially-complete MEMS silicon wafer. By using standard IC processing, we create passive alignment structures in backside cavities on the MEMS wafer. The precision dry assembly utilizes front-to-front registration, removing the need for sidewall slope control of the backside Deep Reactive Ion Etch (DRIE)...
This paper reports a novel process to fabricate electrostatically-actuated, in-plane micromechanical resonators made of fused quartz for high-Q microsensor applications. Two key processes - low temperature plasma-assisted Silicon-on-quartz (SoQ) direct bonding and quartz DRIE using C4F8/He plasma - have been used in combination with thin metallization to fabricate fused quartz resonators driven by...
This paper presents a fabrication technique that utilizes a combination of photolithography and mechanical lapping to achieve a micromachining process to overcome the limitations of conventional machining for realization of millimeter and submillimeter waveguide components. The fabrication process for the waveguide sections begins with spin cleaning a silicon wafer. The SU-8 micromachined part will...
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