The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The design and implementation of a CMOS integrated analog to digital interface dedicated to hybrid integration of MEMS resistive microphone is presented. Audio sensing is achieved with an innovative low-cost technology that uses single crystal piezoresistive silicon nanowires as transducer in a MEMS. The circuit composed of a low-noise instrumentation preamplifier followed by a single bit fourth order...
Silicon smart microchips with CMOS/MEMS technology are realized for Intelligent sensing. In our developed chips, new type sensor chips for bio-medical applications are presented especially here. One is Si microprobe electrode and tube array chips for recording of neurons in the tissue and drug deliver use. The probe array can be fabricated on IC chip, using standard IC process followed by a selective...
Silicon MEMS microphones that offer small size, ease of integration with CMOS electronics, and the ability to withstand lead-free solder reflow cycles, are becoming increasingly popular for high-volume consumer electronic products, and are competing in price and performance with traditional electret condenser microphones. The design of a MEMS microphone, consisting of a compliant membrane and a stiff...
This paper presents a bulk micro-machined single axis accelerometer with analog signal conditioning circuit on a single chip. Design advantages include combining electrical isolation structures and mechanical connection structures with insulating materials refilled trenches to increase transducer sensitivity by minimizing parasitic capacitance, and lower package cost due to post-CMOS process. Several...
This paper reports a monolithically integrated CMOS-MEMS three-axis capacitive accelerometer with a single proof mass. An improved DRIE post-CMOS MEMS process has been developed, which provides robust single-crystal silicon (SCS) structures in all three axes and greatly reduces undercut of comb fingers. The sensing electrodes are also composed of the thick SCS layer, resulting in high resolution and...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.