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Electromigration (EM) failure in flip-chip bumps has emerged as a major reliability concern due to potential elimination of Pb from flip-chip bumps and a continuous drive to increased IO density resulting in a reduction of bump pitch and size. Additionally, the rapid development and implementation of 3D IC structures is introducing new interconnects (u-bumps, RDL, microvias, and TSVs) at a much finer...
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