The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The etch-back of anodic bonded silicon-on-glass wafer using ultrasonic agitation to obtain uniform silicon film and good surface finish in deeply dissolved silicon-on-glass (DDSOG) process has been studied in KOH solution. Etch-back characteristics of p-type (100) 4 inch SOG wafer have been explored under the different ultrasonic power. It has been observed that the characteristics of etch-back such...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.