Search results
physica status solidi (b) > 255 > 5 > n/a - n/a
Journal of Microelectromechanical Systems > 2017 > 26 > 6 > 1165 - 1182
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 12 > 2057 - 2065
Journal of Microelectromechanical Systems > 2017 > 26 > 6 > 1279 - 1286
IEEE Sensors Journal > 2017 > 17 > 20 > 6682 - 6689
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 10 > 1721 - 1728
IEEE Transactions on Electron Devices > 2017 > 64 > 10 > 3998 - 4001
IEEE Transactions on Electron Devices > 2017 > 64 > 9 > 3616 - 3621
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 3 > 585 - 592
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 9 > 1560 - 1566
IEEE Electron Device Letters > 2017 > 38 > 8 > 1035 - 1038
IEEE Transactions on Electron Devices > 2017 > 64 > 8 > 3189 - 3192
IEEE Transactions on Electron Devices > 2017 > 64 > 8 > 3167 - 3173
IEEE Electron Device Letters > 2017 > 38 > 7 > 890 - 893
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 7 > 1003 - 1010
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 2 > 281 - 290
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 6 > 819 - 828
IEEE Sensors Journal > 2017 > 17 > 10 > 3012 - 3021
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 5 > 802 - 805
IEEE Transactions on Electron Devices > 2017 > 64 > 5 > 2022 - 2029