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We propose a high-gain multilayer differential integrated antenna based on antenna-in-package (AiP) solution for 60 GHz communications. Using the conventional low-cost printed circuit board (PCB) process, the 60 GHz phased array antenna element and 16-element phased array antenna prototype are fabricated. For the antenna element, measurement results show that a gain of about 8.9 dBi and bandwidth...
This paper deals with a component placement algorithm for 3D IC design. The Particle Swarm Optimization (PSO) is a general purpose stochastic algorithm mimicking the behaviors of particles self-organizing a system. The size of solution space is very large in the 3D component placement problem and it is afraid that the objective function value will be degraded. The Clustering Algorithm (CA) is an efficient...
This paper proposes some novel substrate-integrated waveguide (SIW) bandpass filters combined with planar resonators. According to specific topologies, microstrip lines with different electrical lengths are introduced into their designs. Their corresponding phase-shift characteristics are used to obtain the desired couplings between SIW cavities and the microstrip resonator. Two third-order filter...
In this paper, the system on chip (SOC) and system in package (SiP) are discussed as two main approaches for system integration. The system on package (SOP) is introduced with the discussion of the integrated passive device (IPD). IPD based on silicon with high resistance is investigated and the SOP using silicon-based IPD is analyzed. It is found that the silicon-based IPD is a good candidate for...
In this paper, a process to fabricate BCB/Au multilayer stack on low resistivity Silicon (Si) based on the embedded package structure is developed, especially for the first time spin coating of the dielectric material on the Si substrate. Transmission lines, including micro-strip transmission lines and coplanar waveguide (CPW) lines are designed, fabricated and characterized, which performs excellently:...
A low cost & feasible system on package solution on the basis of BCB and silicon wafer (10 Ohm·mm)-Si-Based 3D MMCM package solution is presented in this paper. What is more, a standard Si-Based MEMS process is employed to achieve package and revision of a GaAs-Based Monolithic Amplifier circuit. The measured results show that input return loss is less than 20 dB; moreover, small signal gain is...
This paper presents a broadband microwave vertical transition structure suitable for System on Package (SOP) applications at millimeter-wave frequencies (mmW). The designed structure includes a Microstrip (MS) to Stripline (SL) back to back vertical transition optimized for 60 GHz applications but also suitable for E-band frequencies as well. The mmW transition presented here was fabricated in a Low-Temperature...
System on package (SOP) is an emerging technology, and provides an implementation options for system with small size, especially for mixed-signal systems. However, in such a compact package, noise generated by the digital chip can be easily coupled to the RF IC, and degrade the sensitivity of RF signal. In this paper, a simple and efficient multi-order lowpass filter for EMI and SSN suppression in...
In this work, the first mu-strip 60 GHz Rotman lens and new compact low loss strip delay line using low temperature co-fired ceramic(LTCC) are proposed. The lens has 3 steering capability for +26deg, -26deg, 0.1deg angle, - 0.86 dB of side lobe level (SLL), and 28deg of half power beam width (HPBW). The Rotman lens is designed in mu-strip structure for integration capability with the system on package...
In this paper, low cost and highly compact band pass filters and duplexers are investigated for Dual-band WiMAX FEM (front-end module) with multi-layered organic package substrate. This dual band FEM includes a 2,5 GHz power amplifier die with switch and should have tiny PKG form factor for small mobile applications. In addition to module size limitation, FEM requires higher gain and stringent attenuation...
In this paper, we present a self-powered CMOS impulse-based ultra wideband radio system for RFIDs and wireless sensor networks (WSN) applications. It is integrated in a liquid-crystal polymer (LCP) based system on package (SoP) module with an embedded small antenna. Our contribution includes using two different standards in up and downstream link. In downstream link, due to demand of low complex,...
System-on-package (SOP) based on silicon carriers has the potential to provide modular design flexibility and high-performance integration of heterogeneous chip technologies for a wide range of two- and three-dimensional product applications. Key technology enablers include silicon through-vias, high-density wiring, high-I/O chip interconnection, and supporting test and assembly technologies. This...
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