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Influenced by the assembly accuracy of microwave modules, a gap often locates between two different components, such as metal cavity and LTCC substrate, which induces the discontinuity of microwave ground and resonation in millimeter wave band. These influences can be ameliorated by bonding a flexible transmission line between the two different materials, thus the voltage standing wave ratio and microwave...
The challenge of nano packaging requires new nondestructive evaluation (NDE) techniques to detect and characterize very small defects like transportation phenomenon, Kirkendall voids or micro cracks. Imaging technologies with resolutions in the sub-micron range are the desire. But what does nano packaging mean? High end semiconductor industries today deal with functional structures down to 45 nm and...
Fine pitch(?0.5 mm) BGAs were assembled on many kinds of products for many years, such as Smart Handheld Device, Mobile Phone, Network Device, Notebook main board, etc. Normally the BGA defects are solder joint bridge, solder joint open, and BGA solder joint crack during assembly process. Regarding the solder joint crack, most of cases are caused by external force, such as assembly operation, board...
Solder joint crack is a common failure mode of printed circuit board assembly (PCBA) for electronic products. In order to investigate the crack behavior of fine-pitch SMT solder joints, accelerated thermal cycling (ATC) up to 1500 cycles was performed on advanced PCBAs with low-profile thin small outline package (TSOP). The functional examination result shows that the failure rate of TSOP solder joint...
The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or corners of DCB or solder joints...
This paper describes recent developments made to the finite element modeling of solar cells, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of solar cells. Lifetime predictions are made using the creep strain energy based models of Darveaux. This study discusses the analysis methodologies as implemented...
The dynamic responses of printed circuit boards (PCBs) mounted with thin-profile fine-pitch BGA (TFBGA) packages under board level drop tests were investigated. Data captured during the tests include accelerations, in-plane strains and in-situ change in solder joint resistance. PCBs were mounted on the drop table using either 4-screw or 6-screw supports. A high-speed charge-coupled device (CCD) camera...
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