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The paper presents a technological solution for high frequency packaging platform to at least 40 GHz. This approach is based on soft substrate processing. We present results of high frequency packaging of important building blocks, such as bias-T, transimpedance amplifiers. The paper demonstrates a solution for high-frequency hybridization that can be implemented with standard substrates.
Five types of micromachined vertical transitions appropriate for high frequency packaging are presented. The transitions are designed, fabricated and tested for silicon wafers. A "top-via" transition for on-wafer packaging is introduced. This design combines the packaging cavity and the RF transition on a single wafer in order to simplify the integration. This approach offers increased flexibility...
The 60 GHz band has emerged as an international spectrum opportunity for short-range wireless communication networks. In this paper, technology trends that can impact the commercial deployment of systems utilizing millimeter-wave frequency bands are discussed. Millimeter-wave frequency bands have historically been costly to utilize and traditionally used almost exclusively for government and non-consumer...
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