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Electrolessly plated Ni-P has been extensively studied due to its high coating uniformity, selectivity and low coating stress. However, the use of lead-free solders accelerates interfacial reaction because they have higher melting points and higher Sn content than the conventional Pb-Sn solders. In this work, we developed a ternary electroless Ni-Sn-P (6~7 wt.% of P and 15~17 wt.% of Sn) alloy to...
The electrolessly plated Ni-P has been extensively studied due to its coating uniformity, selectivity and low coating stress. However, the use of lead-free solders accelerates interfacial reaction because its higher melting points and higher Sn content than the conventional Pb-Sn solders. In this work, we developed a ternary electroless Ni-Sn-P (7~8 wt.% of P and 1.4 wt.% of Sn) alloy to be used as...
PoP structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones. However, the final stack height from the top to the bottom package for these structures is higher than that of the current stacked die packages. To reduce the height of the package, a flip chip technology is used. Since the logic chips of mobile applications use a pad pitch...
Due to its ease of application pure tin has been selected by the industry as the main alternative to solderable tin/lead deposits following RoHS legislature. After several years of industry experience several issues have developed which are due to the corrosion of the top layer during storage. The most serious of effects has been the growth of whiskers during heat/humidity (55degC/85% r.h.) storage...
The lead-free (Pb-free/100% tin) lead finish quality from two plating suppliers was compared to that of standard 90wt%Sn-1 0wt%Pb plating. A characterization study of the properties of the electroplated tin (Sn) showed that the finish exhibited large stable grains, high purity, comparable ionic contamination levels, and solderability. The assembled modules that employed Pb-free paste for the Sn finish...
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