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In this paper, cohesive zone modeling(CZM) was adopted to simulate the distribution of temperature & stress field and the interface damage on the Cu/EMC double adhesive material electronic packaging. The following phenomena were found: A sharp rise of the EMC temperature appeared at cut portion field when the cutting began, while it had little effect on copperplate. Stress concentration existed...
Heat generated by electronic devices and circuitry must be dissipated to improve their performance, reliability and prevent the premature failure. One of important methods is to fabricate composites with high thermal conductivity. In this study, we develop a novel approach for surface modification of boron nitride nanosheets and silicon nanowires by being decorated with silver nanoparticles. The resultant...
Power semiconductor device technology needs highly efficient heat dissipation system having a chip bonding layer with high thermal conductance and reliability. This work clarifies 3D thermal stress profiles under power cycling test (PCT) and thermal cycling test (TCT) with multi-physics solver for the system having Ag sintered bonding layer as a new chip attachment technology. Both reliability test...
Decisive purpose of transformer oil is to provide effective insulation and cooling to ensure satisfactory performance of the transformer. In practical operation, the transformer experience several stress evolving conditions due to combined thermal and electrical stresses. Both thermal and electrical stresses lead to degradation of oil performance interms of poor dielectric strength and ineffective...
A power module, which includes an insulating plate soldered to a heatsink, is called a direct-cooled power module. There are several packaging technologies to improve a direct-cooled power module in terms of not only reduction of thermal resistance but also elongation of lifetime. Among those approaches, this paper describes optimization of heatsink thickness and prevention of ratchet deformation...
A NFE model is constructed to analyze the heating steady thermal stress in a ZrO2/FGM/Ti-6Al-4V composite ECBF plate considered temperature dependency. From numerical calculation, when T0 = 300 K Ta = 670 and Tb = 1 070 K, the stress distributions in the plate were obtained. The results are as follows. The change of the FGM layer thickness is little effect on the stress in metal layer. Compared with...
To study the reliability of carbon nanofiber (CNF) interconnect under high-current stress, electrical and thermal transports across CNF-electrode interfaces and between electrodes are considered. For this investigation, three different types of contacts are examined: (a) CNF-Au electrode, (b) CNF-SiO2 substrate, and (c) tungsten-deposited CNF-Au electrode. We have determined that contact (c) improves...
Dielectric windows often limit the power handling capability of vacuum electron devices. It is necessary to choose the right dielectric material for high power applications. Depending upon the power level, a range of materials has been used in various systems. The ideal material should have high mechanical strength, high thermal conductivity, high electrical breakdown voltage, low dielectric loss,...
ldquoDevelopment for advanced thermoelectric conversion systemsrdquo supported by the new energy and industrial technology development organization (NEDO) has been successfully completed as one of the Japanese national energy conservation projects. Three types of the cascaded thermoelectric modules operating up to 850 K in high electrode temperature and two types of Bi-Te thermoelectric modules operating...
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