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We report an effective approach to inhibit the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu. By depositing a very thin layer of the solder on Cu and followed by a 10-min reflow, the scallop-type morphology of the interfacial Cu6Sn5 intermetallic compounds (IMCs) became flat and the channels between them closed up. When additional solder was deposited on the sample and reflowed...
Compared with widely used SAC305 (Sn-3.0Ag-0.5Cu) solder, low-Ag (Ag ≤ 1%) SAC solder obviously shows advantages in cost and mechanical impact resistance, and disadvantages in worse wettability, higher melting point and degeneration in electromigration, which restrict its application. Therefore, adding some suitable elements to the solder to improve the solderability and mechanical performance is...
In this study, Ag/NiNiP-plated Cu leadframes from two different processes are compared in terms of NiNiP surface morphology, composition of NiP layer, grain structures of Ni and NiP plated layers, and impurities in the interface of Ni/NiP plated layers. Their impacts were assessed after solder plating and baking. Scanning electron microscopy (SEM) shows that the grain size of Leadframe A (from Process...
To develop a lead-free composite solder for advance electrical components, lead-free SAC solder was produced by mechanically mixing 0.5wt.% TiO2 nanopowders with Sn3.5Ag0.9Cu solder. This paper investigated the formation of intermetallic compounds (IMCs) between Sn3.5Ag0.9Cu composite solder and Cu substrates during reflow soldering at temperatures ranging from 250 to 325°C. Scanning Electron Microscopy...
This study focused on the effect of solder volume on the interfacial reaction between Sn3.5Ag0.75Cu solder balls and Cu pads on PCB after various reflow soldering times. The diameters of the solder balls were 200, 300, 400 and 500 μm, respectively, and the opening diameter of the Cu pads was 250 μm. The solder volume ratio for the 200, 300, 400 and 500 μm balls was approximately 1:4:8:16. The interfacial...
The surfaces of optoelectronic materials such as silicon, GaAs, nitrides and oxides are known to be very difficult to bond with low melting point solders (<;300°C). Small portion of active elements (3.1~4.1wt% Ti and 0.2% Ce) added into conventional SnAg solder could improve its solderability with inorganic material surfaces. In this work, some bonding experiments using active solder containing...
Advanced wafer technology node has moved forward to 40 nm and below with an ultra low-K (ULK) dielectric constant value of 2.5. ULK shows lower mechanical strength and poor adhesion than that of low-K dielectric. Cu/ULK delamination becomes the major concern during the packaging reliability test. After eliminating the Cu/low-K delamination issue, experimental result shows that die crack become another...
Adhesion has been identified as one of the key elements in solving failure problems in electronic packaging. Understanding and improving the adhesion between epoxy molding compound (EMC) and leadframes is thought to be a key step towards improving package performance. The objective of this work was to study the effect on adhesion behavior and delamination of plastic packages using various metal coated...
One promising application of CNTs in microelectronics is to use vertically aligned CNT (VACNT) arrays as novel thermal interface materials (TIMs). No doubt that the vertical alignment makes the best of the extremely high longitudinal thermal conductivity of individual CNTs; however, it is the CNT/substrate interface that exerts the main restriction on phonon transport through a TIM layer. There are...
Cu dendrite growth of quad flat package linked to epoxy molding compound (EMC), leadframe, and leadframe adhesive tape is comprehensively investigated. Cu dendrite grows particularly in the lead pitch smaller than les 130 mum covering with a leadframe tape, and in turn, it results in a resistive short. Such an appearance is attributed to test procedure of the precondition (30degC/60% relative humidity...
The adhesion of copper/liquid-crystalline polymer bilayer lamination structures with various thickness fabricated with chemical electroless copper deposition (CECD) and surfaced activated bonding (SAB) were characterized mechanical shear-off tests. The influence on the surface morphology and chemical state during different processes, including sulfuric acid bath, heat treatments, plasma treatments...
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