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The blend was synthesised with bismaleimide (BMI) resin and bisphenol A-based cyanate ester (BADCy) resin. The BMI/BADCy copolymer showed excellent dielectric and thermal conductivity properties. The volume resistivity of the copolymer was a little lower than BADCy system. The volume resistivity of blend was 7.8 × 1015 Ω·cm when the BMI content was 20 wt%, which still showed good insulation performance...
Build-up process is a highly effective method for miniaturization and high density integration of printed circuit boards. Along with increasing demands for high transmission speed of electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to reduce the transmission loss. We report our insulation materials used in a semi-additive...
This work is focused on the characterization of dielectric, mechanical and physicochemical properties of a commercially available PEI resin. The complex shear modulus is determined using the Dynamic Mechanical Analysis (DMA). The complex dielectric permittivity is measured using the broadband dielectric spectroscopy. In order to complement the mechanical and dielectric results, Differential Scanning...
This paper present a study of casting compounds used in the electrical industry, especially in manufacturing and repairs of electric rotary machines. The basic types of casting resins and their basic application in the electrical industry are described. This paper focuses on electrical and mechanical properties of selected casting resins. The chosen diagnostic system should give an objective point...
Specific properties of insulation systems based on thermosetting and thermoplastic polymers can be enhanced by adding different types of inorganic fillers. The focus of this paper is on the effect of the filler size and modifications of the crystallinity of aluminum oxide (Al2O3) nanoparticles on the dielectric and thermal properties of epoxy-based composites. Nanoalumina in the α, γ and δ phases...
Electrical insulation based on epoxy resin is commonly used in high voltage applications. Examples are transformers, terminations, plugs or connectors. But, it is also used in high voltage applications where energy transportation or distribution is not the main purpose, e.g. in medical and industrial X-ray systems, or radar. This paper addresses the changes in the structure due to the introduction...
The spin-coating process was adopted in the fabrication of capacitors on flexible substrates. High dielectric constant materials were mixed with resins to increase dielectric constant of capacitors by a trip-roller. The effect of added content of high dielectric constant materials on the dielectric properties were studied in this work. In this study, high dielectric ceramic powder and aluminum powder...
This paper evaluated the influences of silica nanoparticles on the dielectric properties, mechanical performances and glass transformation behaviors of epoxy resin by analyzing the temperature dependence of dc conduction and dielectric loss, impact test results and dynamic mechanical data, respectively. The particular attention was given to the correlation between the glass transformation behaviors,...
Epoxy polymers reinforced with a premixed epoxy/nano-silica masterbatch or dry non-surface-treated nano-silica and ground micro-silica flour were compared. Cured plates of epoxy containing both nano-particles (up to 15 %wt) and micro-particles (up to 51 %wt) of silica were produced and tested. The glass transition temperature, Tg, of the epoxy was measured using differential scanning calorimetry (DSC),...
In this paper, epoxy resin based composites filled with nano-silica were fabricated. The relationships between the dielectric properties as well as glass transition temperature (Tg) and nano-filler content were investigated. The results showed that, relative permittivity (??r) and dielectric loss tangent (tan??) decreased when filler content was no more than 0.3 wt.%, and reached minimum value at...
Recently, high frequency signal transmission has been widely used in communication and broadband technologies, and even in mini-electronic devices. When signals travel at a high speed, how to maintain signal integrity becomes an important issue. Therefore, the electric properties in terms of dielectric constant (Dk) and loss factor (Df) of laminate materials for PCB production are more and more concerned...
In the past, high-frequency communication applications put emphasis on low loss while high speed signal transmission is required to achieve the integrity of the signal. In order to ensure the target of low loss on the CCL materials, most studies focus on how to reduce the polarity for resin system to achieve low Dk and low tan ?? to improve the signal characteristics of high-speed transmission. The...
Effects of addition of micro-sized silica fillers and/or nano-sized clay fillers into epoxy resin on its dielectric properties were examined. The glass transition intermediate temperature (Tg) was found to show a decrease by the addition of a small amount of nanofillers, while it is increased by the addition of abundant microfillers with and without co-addition of a small amount of nanofillers. At...
Over these years, market trend and government regulation have lead to the introduction of halogen free material. As CCL supplier, we consider that the benefit of halogen free resin not only for environmental consideration but also enhance some particular characteristics for specific PCB application. We have developed a novel halogen free material. Except excellent thermal performance, we also develop...
In this paper, a microstrip line is used for extracting the frequency dependent material properties such as dielectric constant, attenuation constant, and loss tangent of ten different printed circuit boards (PCBs). Besides the better electric properties, the LD materials with excellent heat resistance can meet high temperature lead free process.
Dielectric materials used for high power applications currently tend to be based upon either bulk ceramics or liquids such as ethylene glycol-water mixtures. Both of these approaches suffer problems in use; ceramics have limited strength and are brittle, whilst liquid based materials have chemical compatibility and environmental issues and cannot be used in applications that require a solid-state...
In this paper, we report some preliminary measurements on the dielectric response and properties of boron nitride filled epoxy resin composites consisting of a typical anhydride cured bisphenol-A epoxy resin system. Both conventional stirring and ultrasonic processing had been used to obtain fine dispersion of the microfillers in the matrix. Dielectric spectroscopy of the samples has been undertaken...
Considerable attention has been devoted to the synthesis and application of nanoparticles because of their unusual physical and chemical properties resulted from the ultra-fine size and ultra-large surface area. Polymer composite materials based on metal nanoparticles provide a potential solution to meet the present and future technological demand in virtue of the good processibility and mechanical...
Conductive filler-polymer composite materials have been extensively investigated as conductor-insulator percolative system to achieve high dielectric constant (K). Additionally, the effective dielectric constant of conductive filler/polymer composite can be dramatically enhanced by increasing the dielectric constant of polymer matrix according to scaling theory. However, the high dielectric loss of...
Restraining the impurity ions' conductance under high temperature and preventing movement and accumulating of the ions under high field are concerned much in power silicon devices' surface passivation. More attention should be paid to the high temperature conductance characteristic of silicone resin modified polyester (SP), which is used in power silicon device's surface protection. The resistivity-temperature...
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