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In this paper, we identify the key challenges that oppose sub-threshold circuit design and describe fabricated chips that verify techniques for overcoming the challenges
Three-dimensional (3D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several other advantages, it is expected that the benefits from this technology can potentially be off-set by thermal considerations which impact chip performance and reliability. The work presented in this paper is the first attempt...
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