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The industrial production process is analyzed. Information, what accompanies the general production cycle is analyzed. Identified the structure of the information sub-system for quality indexes monitoring.
Simulation plays an important role in researching, developing and testing Integrated Circuit (IC) manufacturing equipments. It is possible to test most of the functions and performance on simulation platform, and simulation platform can be used to verify the consistency of the process and the reliability of IC manufacturing equipment at the same time. In order to achieve a class of general and configurable...
The use of machine learning algorithms such as Gradient Boosting Trees (GBT) and Random Forest (RF) have enjoyed some successes for Intel class test yield prediction and analysis. However, we have not attempted it on Intel assembly data mainly due to the lack of Design of Experiment (DOE) data. In addition, it is a continual effort to reduce the cost of DOE for data-driven engineering decision. Clearly...
The SAP-APO is an IT-solution for the supply network planning of global enterprise. It provides a decision support for the business operations in terms of long-terms as well as mid-terms business logistics optimization. This paper develops a logistics solution based on the framework of SAP-APO for the IC manufacturing industry. In it, an integrated solution framework is proposed and some planning...
For mature technologies, main yield detractor is random defectivity. Nevertheless, some devices present higher defectivity than rest of devices. Out of process accident, design related defect is one of suspected root cause. Also, design-based defect type is expected to increase as technology node decreases. Determining origin of these additional systematic defects is not easy as these defects are...
This research develops interaction models among companies in IC supply chain to study the information integration among them. The main processes of IC supply chain are IC design, wafer fabrication, wafer probe, IC packaging/assembly, and final test. A workflow model between IC design houses and wafer fabrication plants is developed with focuses on purchase order, engineering data, and work-in-process...
Contemporary factories in capital intensive industries such as semiconductor manufacturing are very complex, with many sources of risk. The highly competitive and global business environment forces companies to analyze, design, and continuously re-design factories with distributed multi-disciplinary teams. Traditional factory design approaches using spreadsheets and stand-alone simulations cannot...
We propose an integer programming (IP) framework to undertake the dedicated photolithography machine constraint in semiconductor manufacturing. The constraint is one of the new challenges set by the process engineer in semiconductor manufacturing due to natural bias of photolithography machines. Previous researches either did not take the constraint into account or the proposed heuristic approach...
Advances in technology are making it imperative to collect detailed structural IC fail data during manufacturing test to improve yield. However, there is currently no standard format for communicating and storing such structural fail data efficiently. This leads to ad-hoc tool-specific solutions, which do not offer interoperability required in a typical multi-tool, multi-vendor customer environment...
Placement machine is the most critical equipment of SMT (surface mount technology). Using visual location technology in its pick and place process can offer a high speed and precision component placement. This paper presents a visual location system based on machine vision for the placement machine. It begins with an introduction of placement machine and then describes the design and implementation...
Scheduling of semiconductor wafer fabrication system is identified as a complex problem, involving multiple and conflicting objectives (makespan and minimizing waiting time for instance) to satisfy. In this study, we propose an effective approach based an artificial neural network technique embedded in a multi-objective optimization loop for multi-decision scheduling problems in a semiconductor wafer...
In order to design and implement the information systems and modules that could comprise an ldquoindustrial strongrdquo knowledge-based tool, links to shop floor systems containing real-time production data and PCA customer information (e.g. bill of materials (BOM), CAD drawings) are required. Details of the issues of implementing the tool in an industrial organisation and the integration of various...
The following article introduces OMaCS (online management and control system), a multiple client single server software system for the control of crystal growth systems (e.g. multi-zone furnaces). OMaCS has especially been tuned to the needs of the process thus allowing quick and efficient co-operating of different user groups. The software is a flexible system applicable for different types of growing...
We previously showed that microparts can be fed along a saw-toothed surface using simple planar symmetric vibrations. Microparts move forward because they adhere to the saw-toothed surface asymmetrically. Using saw-toothed silicon wafers fabricated by a dicing saw applying bevel type blades, we evaluated the principle of unidirectional feeding of 2012-type capacitors (size, 2.0 times 1.2 times 0.6...
In view of semiconductor wafer probe area's workshop management and control problem, with the thought of object-oriented, a behavior model of probing workshop is set up in terms of the figuration of UML. Paper puts forward an integrated workshop control strategy considered three factors; wafer releasing speed, dispatching rule and buffer capacity. It uses the SimTalk brought by EM-plant to transform...
Recently, many inspection systems are using computer vision technology. We also use computer vision to recognize the position error for mounting a wafer in a cleaning process of the semiconductor production processes. The robot moves wafer to the cleaning chamber. But sometime, the robot puts the wafer into an incorrect location. In this case, incorrect position becomes cause of the cleaning system...
This paper proposes a selection scheme (S-scheme) between neural-network (NN) and multiple-regression (MR) outputs of a virtual metrology system (VMS). Both NN and MR are applicable algorithms for implementing VM conjecture models. But a MR algorithm may achieve better accuracy only with a stable process, whereas a NN algorithm may has superior accuracy when equipment property drift or shift occurs...
Methodologies for detecting non random spatial patterns on Sort bin wafer maps and discovering their fab tool commonalities are presented. The challenges encountered in implementing modern statistical learning algorithms for this task are discussed as well as their advantages over traditional methods. The methods are then demonstrated on production data.
Online monitoring of complex processes, such as semiconductor manufacturing processes, often requires the need to analyze sensor data with multiple characteristics. Some of these characteristics include nonstationary behavior, non-Gaussian distribution, high frequency of data generation, and multiscale (multiple frequencies) noise that mask the true nature of the process. Furthermore, it is necessary...
Fluctuations of work-in-progress (WIP) levels cause variability of cycle time and often lead to productivity losses in semiconductor wafer fabrication plants. To identify sources of such variability, we are developing a root cause analysis tool with history logs of operational events, such as high WIP or equipment downtime, as inputs to automatically find the chains of events that create the variability...
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