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This failure analysis concerns a commercial DC–DC module assembled on board, which the OP-AMP servo stage is failed. The electrical failure is an intermittent open circuit on the pins of the OP-AMP. When the board is powered ON, the open circuit generates a malfunction of the servo stage and leads either, to an overvoltage on the module output, or to one input destruction by electrical over stress...
Copper (Cu) wire has been highlighted as a low cost material for use in thermo sonic ball bonding for various package (PKG) groups. This wire has already been applied in high-end PKGs such as BGA, QFP and QFN in mass production, and the volume is feasible. Not only the advantage of a low cost material, but Cu wire has other merits which include higher electrical conductivity and a much slower intermetallic...
In power management semiconductor industry, the most comprehensively used metals in microelectronic packages include copper, aluminum, nickel, gold and silver. When different metals contact to each other, intermetallic compound (IMC) will form at the interface. Under different conditions, IMC may vary to show very complicated characteristic and composition, some Moderate IMC will increase interfacial...
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