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This paper presented a failure analysis methodology to overcome the difficulties of fault location encountered by pin leakage and some testing parameter failures in a mixed signal device. These types of failure generally cannot be solved by traditional electrical failure analysis methods.
Detection of killer defects is critical to improving yields in VLSI fabrication. Bright and dark-field inspection tools detect both killer and non-killer defects, and in some cases a high level of nuisance defects may adversely affect the ability to monitor and eliminate the real ones that have a detrimental impact on device yield. E-beam inspection tools take advantage of a phenomenon referred to...
Charge-induced voltage alteration (CIVA) is a new scanning electron microscopy technique developed to localize open conductors, on both passivated and depassivated ICs. CIVA overcomes the limitations usually encountered in localizing open conductors. CIVA images are produced by monitoring the voltage fluctuations of a constant current power, supply as an electron beam is scanned over the IC surface...
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